Disclosed is a system and method for the recycling of waste composite feed materials such as printed circuit boards (PCBs), batteries, catalysts, plastic, plastic composites such as food packaging materials, for example Tetra Pak, mattresses, compact disks (CDs, DVDs), automobile shredder residue (ASR), electric cable wastes, liquid display panels, mobile phones of various sizes or combinations of the above using a new pyrolysis system and method.

Systems and processes for recycling printed circuit boards, wherein precious metals may be reclaimed. The system generally includes a number of modules to systematically remove materials from the printed circuit boards and to separate the precious metals from the materials.

A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.

An information handling system mouse couples upper and lower housing portions with a central lock that insert though an opening of the lower housing portion to rotationally engage opposing cam surfaces. The upper and lower housing portions capture a printed circuit board that provides mouse functions without any screws or adhesives used to couple the mouse together. The mouse other than the printed circuit board is made of recyclable plastic that readily disassembles.

A powder gathering apparatus includes at least two rotating plates and a driving mechanism. The at least two rotating plates are disposed with respect to each other. Each of the rotating plates includes at least one spherical member. The at least one spherical member protrudes from the rotating plate. The driving mechanism drives at least one of the at least two rotating plates to move, such that the at least two rotating plates get close to or away from each other. The driving mechanism drives the at least two rotating plates to rotate.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

A system includes a stress-engineered substrate comprising at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress. The at least one tensile layer and the at least one compressive layer are coupled such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating. At least one functional device is disposed on the stress-engineered substrate. The stress-engineered substrate is configured to fracture in response to energy applied to the substrate. Fracturing the stress-engineered substrate also fractures the functional device. The system includes at least one decoy device. Fragments of the decoy device are configured to obscure one or more physical characteristics of the functional device and/or one or more functional characteristics of the functional device after the functional device is fractured.

The subject of the present invention is a method for processing electrical and electronic components in order to recover valuable materials, such as the metals contained in printed circuit boards. According to this method, the electrical and electronic components are pre-shredded mechanically and then mixed with a liquid before they undergo wet milling (5).

A biodegradable system includes a biodegradable substrate which can be a biodegradable paper or polymer. A biodegradable power source is printed or deposited above the substrate, and biodegradable processor and communication circuits are in turn formed on the substrate. The processor and wireless communication system can communicate with a remote computer to provide information about the source of the items (optionally tracked using the blockchain supply chain tracking), the relevant dates (production and expiration dates), any attempt to tamper with the packaging, and suitable warnings or usage instructions, for example. Optionally, a biodegradable display can render information to a customer, for example.

A method, apparatus and system for processing a composite waste source, such as e-waste, is disclosed. The composite waste source may comprise low-, moderate and high-melting point constituents, such as plastics, metals and ceramics. The composite waste source is heated to a first temperature zone, causing at least some of the low-melting point constituents to at least partially thermally transform. The composite waste source is subsequently heated to a second, higher, temperature zone, causing at least some of the moderate-melting point constituents to at least partially thermally transform. At least some of the at least partially thermally transformed constituents may be recovered. The method, apparatus and system disclosed may provide for the recovery and reuse of materials which would otherwise be sent to landfill or incinerated.