An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.

The system and method described herein provides a system and method for using ion-exchange resins to remove excess copper during processes such as PCB (Printed Circuit Board) fabrication using cupric chloride etchants. Cu.sup.+2 is used to oxidize solid copper producing two Cu.sup.+ ions. During operation, the etchant is overloaded with copper ions and an extraction system is implemented to control the concentration and remove excess copper. Traditional systems use liquid extractions but these systems can be costly and use hazardous solvents. Ion-exchange resins serve as a solution for controlling the concentration, absorbing metal ions and retaining them until desorption. The system and method further determines the effectiveness of the resin in removing the copper based on performing adsorption and desorption at varying flow rates. The results showed that the resin effectively removes copper at various flowrates, removing an average of 10.06 g/l Cu from a bulk value of three beds of etchant.

A nondestructive method generates a representation of a pattern of electrically conductive material on at least one layer of a multiple-layer printed circuit board (PCB). The method generates a plurality of imaging slices by evaluating the voxels in a 3D nondestructive data set to identify voxels having intensities representing electrically conductive material. The method establishes a reference plane that includes at least one voxel identified in a selected one of the plurality of slices. The method determines a distance of other voxels from the reference plane and adjusts the respective 3D coordinate of each other voxel to effectively position a respective adjusted voxel in the reference plane. The method generates a two-dimensional (2D) image that includes the at least one voxel and the adjusted voxels in the reference plane. The 2D image represents the pattern of electrically conductive material in the at least one layer.

There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.

An object of the present technology is to provide a copper clad laminate including a resin substrate that has biodegradability and less likely to warp or crack. The present technology provides a copper clad laminate including: a resin substrate; an adhesive layer; and a copper foil layer, the adhesive layer and the copper foil layer being stacked in this order on at least one side of the resin substrate, the resin substrate containing at least 50 mass % or more of polylactic acid, the degree of crystallization of the polylactic acid calculated on a basis of a result of differential scanning calorimetry being 29% or more and 36% or less, a crystallite size of the polylactic acid calculated on a basis of a result of X-ray diffraction measurement being 19 nm or more and 26 nm or less. Further, the present technology provides a printed wiring board formed using the copper clad laminate.

A method of recycling an integrated circuit (IC) from a printed circuit board (PCB) is provided and includes identifying a target device on a used printed circuit board. The used board is subjected to a screening process including visually inspection and meeting certain criteria. The used printed circuit board is discarded if it is rejected by the screening process. The method further includes preconditioning the used printed circuit board at a temperature greater than 100 C. for a period of time of at least 48 hours, and desoldering the target device from the printed circuit board to isolate the target device. The isolated target device is subjected to visual inspection and functional testing. The isolated target device is then heat treated at a temperature greater than 100 C. for a period of time of at least 12 hours, and subsequently stored in an electrostatic-discharge-protected environment in presence of nitrogen gas.