A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive connection posts protrude from the component substrate. One or more electrically conductive component contact pads are exposed on or over the component substrate on a side of the component substrate opposite the one or more connection posts. The one or more component contact pads and the one or more electrically conductive connection posts are both electrically connected to the circuit. The components can be printed onto a destination substrate and electrically connected to contact pads on the destination substrate through the connection posts. The components can also be printed onto other components and electrically connected through the connection posts and component contact pads to form a three-dimensional electronic structure.

The invention is related to an electronic assembly comprising a printed circuit board and an electronic component. The printed circuit board comprises a first side and a second side opposite to the first side. The electronic component is installed in the first side of the printed circuit board. The printed circuit board is an insulated metal substrate printed circuit board and comprises a bending portion which divides the printed circuit board into a first main portion and a second main portion, the electronic component being located in the first main portion. The first and second main portions are not comprised in a common plane.

An electronic component module includes a substrate; a plurality of electronic components mounted on the substrate; and a heatsink fixed to the substrate.

The substrate includes first, second and third substrates. The electronic components include first components and second components, and the first substrate and the second substrate are arranged such that the surface of the first and second substrates mutually face each other.

The third substrate is disposed between the first substrate and the second substrate, whereby the first, second and third substrates are continuous. The heatsink includes a fixed portion fixed to at least one substrate among the first substrate, the second substrate and the third substrate, and a side portion located in a side area of a region sandwiched between the first substrate and the second substrate. The side portion is continuous with the fixed portion via a bend portion having a bent shape.

The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.

A solder paste is printed on a first surface of a sheet. Connectors are mounted on a first surface of a first board and a second surface of a second board. The sheet is inverted. A solder paste is printed on a second surface of the sheet. Connectors are mounted on a second surface of the first board and a first surface of the second board. The solder paste printed onto the second surface of the sheet is melted. The first board is separated from the second board. The first and second board have the same connector layout. A first connector soldered to the first surface of the first board and a second connector soldered to the second surface of the second board are disposed at a location where the sheet can be bent and broken along the separation line.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

A solder paste is printed on a first surface of a sheet. Connectors are mounted on a first surface of a first board and a second surface of a second board. The sheet is inverted. A solder paste is printed on a second surface of the sheet. Connectors are mounted on a second surface of the first board and a first surface of the second board. The solder paste printed onto the second surface of the sheet is melted. The first board is separated from the second board. The first and second board have the same connector layout. A first connector soldered to the first surface of the first board and a second connector soldered to the second surface of the second board are disposed at a location where the sheet can be bent and broken along the separation line.

The conductor for a touch panel is manufactured by forming, on an insulating transparent cover member, at least one the thickness changed part obtained by changing a thickness of a portion to be deformed during forming with respect to a thickness of other portion in advance, forming a conductive film laminate by disposing a conductive member on a surface of the cover member, and performing collective forming into a three-dimensional shape such that the conductive film laminate is deformed at a portion where the thickness changed part is formed.

Disclosed is a printed circuit board having a holder for a battery, wherein the holder includes first and second contacts connected to conductive traces of the printed circuit board and wherein the holder is embodied such that a battery inserted into the holder is clamped so that poles of the battery on opposite end faces of the battery make electrical contact with the first and second contacts. The battery lies clamped between the contacts on a support region of the printed circuit board and is oriented with reference to the printed circuit board so that an imaginary line connecting the poles of the battery is essentially in parallel with the plane of the support region. The printed circuit board has connected with the support region a rigid first section, which is essentially perpendicular to the support region, and wherein the first contact is arranged on the first section.