A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

A control unit (10) for an apparatus, the control unit (10) comprising: a component-carrying member (18) provided with at least one electronic component (29) configured to provide a function of the apparatus; wherein the component-carrying member is formed of a material that is pliable at least during assembly of the control unit (10); and a laminate encapsulation layer (22) encapsulating at least a part of the or each electronic component (29). Optionally, the control unit comprises a second member (14) which defines a user-interaction surface (16).

An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.

A screen-printing screen for printing electrically conductive patterns on glass sheets, includes a main mask, the aperture size of the main mask being larger in a lateral portion than in the central portion, the screen furthermore including, in at least one double-mask zone, located in the central portion, at least one secondary mask fastened to a face of the main mask, the aperture size of the or each secondary mask being larger than the aperture size of the main mask in the central portion, and the mesh of the or each secondary mask making, with the mesh of the main mask, an angle ? comprised between 1 and 89?.

An arrangement arranged to enclose a circuit board comprising electronic components is described. The arrangement comprises a structure designed to receive the circuit board and the electronic components, a housing designed to receive the structure, a cover designed to be connected to the housing, and an electric socket adapted to provide the circuit board with electricity. The electric socket is comprised in at least one of the housing or the cover. The arrangement is arranged to enclose the circuit board by the housing and the cover, wherein the structure is designed to be releasable and at least partly bear against the circuit board and the electronic components. A tool comprising an arrangement is also described.

Assemblies, systems, and methods are described herein for a removable lid for flip chip-ball grid array (FC-BGA) packages. An example removable lid assembly for an integrated circuit (IC) package includes at least one pedestal configured to be attached to a substrate, a lid configured to be reversibly secured to the at least one pedestal, and a plurality of fasteners configured to reversibly secure the lid to the at least one pedestal. In an installed state of the removable lid assembly in which the removable lid assembly is attached to the substrate, the lid is spaced from the substrate and the electrical components of the substrate. In the installed state, the removable lid assembly enhances a stiffness of the substrate, thereby reducing warpage of the substrate during a reflow process applied to the substrate. Corresponding systems and methods are also provided.

A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.

A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting nanostructured material through a membrane such that the electrically conducting nanostructured material is deposited on the membrane; b) depositing an elastomeric polymerizable material on the electrically conducting nanostructured material and curing the elastomeric polymerizable material thereby embedding the electrically conducting nanostructured material in an elastomeric polymer thus formed; and c) separating the elastomeric polymer with the embedded electrically conducting nanostructured material from the membrane to obtain the flexible electronic device. Flexible electronic device manufactured by the method, and use of the flexible electronic device are also provided.

A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.