An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

In some examples, a corner shield is provided for protecting a surface-mount device (SMD) on a printed circuit board (PCB). An example corner shield comprises a rigid structure configured to conform to a corner area of the SMD, and one or more mounting surfaces configured to mount the rigid structure to one or more soldering pads on the PCB adjacent to the SMD.

A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.

A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.