A low cost IC solution is disclosed to provide Super CMOS microelectronics macros. Hereinafter, the Super CMOS or Schottky CMOS all refer to SCMOS. The SCMOS device solutions with a niche circuit element, the complementary low threshold Schottky barrier diode pairs (SBD) made by selected metal barrier contacts (Co/Ti) to P- and NSi beds of the CMOS transistors. A DTL like new circuit topology and designed wide contents of broad product libraries, which used the integrated SBD and transistors (BJT, CMOS, and Flash versions) as basic components. The macros include diodes that are selectively attached to the diffusion bed of the transistors, configuring them to form generic logic gates, memory cores, and analog functional blocks from simple to the complicated, from discrete components to all grades of VLSI chips. Solar photon voltaic electricity conversion and bio-lab-on-a-chip are two newly extended fields of the SCMOS IC applications.

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.

A mask read-only memory array is provided. The mask read-only memory array includes a semiconductor substrate having a surface; and a heavily doped layer formed on the surface of semiconductor substrate. The mask read-only memory array also includes a plurality of lightly doped discrete regions formed on the heavily doped layer, and a metal silicide layer formed on the lightly doped discrete regions. Wherein the metal silicide layer and the plurality of reverse type lightly doped discrete regions form a plurality of Schottky diode memory cells. Further, the mask read-only memory array includes conductive vias formed one a partial number of the plurality of Schottky diode memory cells for applying column selecting voltage to select certain memory cells.

Provided are improved semiconductor memory devices and methods for manufacturing such semiconductor memory devices. A method may incorporate the patterning of the array and periphery regions in self-aligned quadruple patterning and provide semiconductor devices resulting from the combined patterning.

A control chip including a first processing circuit, a second processing circuit, and a storage circuit. The first processing circuit provides a learning procedure and learning data. The second processing circuit is configured to execute the learning procedure. The storage circuit stores the learning procedure and the learning data. In response to an access request pointing to the learning procedure, the storage circuit determines whether the access request is a correct access request. In response to the access request being a correct access request, the storage circuit provides the learning procedure to the second processing circuit. In response to the access request pointing to the learning data, the storage circuit determines whether the access request is provided from the second processing circuit. In response to the access request being provided from the second processing circuit, the storage circuit provides the learning data to the second processing circuit.

A semiconductor device includes a semiconductor substrate, an internal circuit provided on the semiconductor substrate, a first and a second pads connected to the internal circuit, a first ESD protection circuit connectable to the first pad, and a second ESD protection circuit connectable to the second pad. The first ESD protection circuit includes a first ESD protection element, and the second ESD protection circuit includes a second and a third ESD protection elements. The second pad is connected to the internal circuit via the second ESD protection element, and the first pad is directly connected to the internal circuit.

A semiconductor device is provided. The semiconductor device includes a metal-oxide-semiconductor field-effect-transistor (MOSFET) device electrically attachable to a first data line and a read-only memory (ROM) element. The ROM element is electrically interposable between the MOSFET device and a second data line. The ROM element includes first and second sets of memory cells in high and low resistance states, respectively, to form a secure identifier (ID).

A semiconductor device and a method of forming the same are provided. The semiconductor device includes a first logic die including a first through via, an image sensor die hybrid bonded to the first logic die, and a second logic die bonded to the first logic die. A front side of the first logic die facing a front side of the image sensor die. A front side of the second logic die facing a backside of the first logic die. The second logic die comprising a first conductive pad electrically coupled to the first through via.

A semiconductor device and a method of forming the same are provided. The semiconductor device includes a first logic die including a first through via, an image sensor die hybrid bonded to the first logic die, and a second logic die bonded to the first logic die. A front side of the first logic die facing a front side of the image sensor die. A front side of the second logic die facing a backside of the first logic die. The second logic die comprising a first conductive pad electrically coupled to the first through via.

A chip package used as a logic drive, includes: multiple semiconductor chips, a polymer layer horizontally between the semiconductor chips; multiple metal layers over the semiconductor chips and polymer layer, wherein the metal layers are connected to the semiconductor chips and extend across edges of the semiconductor chips, wherein one of the metal layers has a thickness between 0.5 and 5 micrometers and a trace width between 0.5 and 5 micrometers; multiple dielectric layers each between neighboring two of the metal layers and over the semiconductor chips and polymer layer, wherein the dielectric layers extend across the edges of the semiconductor chips, wherein one of the dielectric layers has a thickness between 0.5 and 5 micrometers; and multiple metal bumps on a top one of the metal layers, wherein one of the semiconductor chips is a FPGA IC chip, and another one of the semiconductor chips is a NVMIC chip.