A method to fabricate a resistive change element. The method may include forming a stack over a substrate. The stack may include a conductive material, a resistive change material, a first surface, and a second surfaces opposite the first surface. The method may further include depositing a first material over the stack such that the first material directly contacts at least one of the first surface and the second surface of the stack. The method may also include after depositing the first material, forming a second material over the first material and evaporating a portion of the first material through the second material to create a gap between the second material and the at least one of the first surface and the second surface of the stack.

Provided are a flexible organic light-emitting display device and a method of manufacturing the same. The flexible organic light-emitting display device includes a metal oxide infiltrated layer as part of at least one of a plurality of organic layers stacked on and around an organic light-emitting device.

An organic light-emitting diode display is disclosed. In one aspect, the display includes a substrate, a scan line formed over the substrate and configured to provide a scan signal, and a data line crossing the scan line and configured to provide a data voltage. A driving voltage line crosses the scan line and is configured to provide a driving voltage. The display also includes a switching transistor electrically connected to the scan line and the data line and a driving transistor electrically connected to the switching transistor and including a driving gate electrode, a driving source electrode, and a driving drain electrode. The display further includes a storage capacitor including a first storage electrode formed over the driving transistor and the driving gate electrode as a second storage electrode. The second storage electrode overlaps the first storage electrode in the depth dimension and extends from the driving voltage line.

A flexible wireless communication device with high position accuracy and low cost by a simple process is described, including a wireless communication device and a method for manufacturing a wireless communication device formed by bonding a first film substrate on which at least a circuit is formed and a second film substrate on which an antenna is formed, in which the circuit includes a transistor, and the transistor is formed by a step of forming a conductive pattern on the first film substrate, a step of forming an insulating layer on the film substrate on which the conductive pattern is formed, and a step of applying a solution including an organic semiconductor and/or a carbon material on the insulating layer and drying the solution to form a semiconductor layer.

An organic thin film transistor, a manufacturing method thereof and an array substrate are provided. The manufacturing method of an organic thin film transistor includes: forming an organic semiconductor layer; partially sheltering the organic semiconductor layer, so that a sheltered region and an unsheltered region are formed on the organic semiconductor layer, the sheltered region corresponding to a region where an active layer of the organic thin film transistor needs to be formed; and doping the organic semiconductor layer, so that the organic semiconductor layer in correspondence with the sheltered region is not doped, and the organic semiconductor layer in correspondence with the unsheltered region is doped.

A thin-film transistor including a substrate, a gate electrode positioned on the substrate, a gate insulating layer positioned on the substrate and the gate electrode, a source electrode positioned on the gate insulating layer, a drain electrode positioned on the gate insulating layer, a semiconductor layer connected to the source electrode and the drain electrode, and a protective layer positioned on the semiconductor layer. The source electrode and the drain electrode each have a surface including asperities.

A thin-film transistor array includes a substrate and thin-film transistors positioned in matrix on the substrate. The thin-film transistors each include source and drain electrodes formed on a gate insulation layer, and a semiconductor layer formed on the gate insulation layer and positioned between the source and drain electrodes. The semiconductor layer is formed in stripes over the plurality of thin-film transistors such that one of the stripes has a long axis direction coinciding with a channel width direction of one of the thin-film transistors. The semiconductor layer has a cross section in a short axis direction of the stripe such that a thickness of the semiconductor layer gradually decreases outwardly from a center portion of the stripe.

A flexible array substrate structure and manufacturing method thereof are disclosed, in which the patterning process of an organic semi-conductive layer is achieved by using the inside wall of the opening of a color film layer as a bank, so that one mask can be saved. Also, a process for manufacturing a device can be simplified by an improved device structure, so that the flexible array substrate structure of the invention can be obtained by only using four masks.

A multilayer structure including a substrate and a first stack of a layer of SiO.sub.2 and a layer of material of the SiO.sub.xN.sub.yH.sub.z type positioned between the substrate and the layer of SiO.sub.2, in which the layer of SiO.sub.2 and the layer of material of the SiO.sub.xN.sub.yH.sub.z type have thicknesses (e.sub.B, e.sub.A) such that the thickness of the layer of SiO.sub.2 is less than or equal to 60 nm, the thickness of the layer of material of the SiO.sub.xN.sub.yH.sub.z type (e.sub.B) is more than twice the thickness (e.sub.A) of the layer of SiO.sub.2, and the sum of the thicknesses of the layer of SiO.sub.2 and of the layer of material of the SiO.sub.xN.sub.yH.sub.z type is between 100 nm and 500 nm, and in which z is strictly less than the ratio (x+y)/5, and advantageously z is strictly less than the ratio (x+y)/10.

Provided is a display device including a substrate having a first region and a second region adjacent to the first region. The second region is located in a direction from the first region to an outside of the substrate. The first region possesses a transistor, a leveling film over the transistor, and a light-emitting element over the leveling film and electrically connected to the transistor. The display device further includes a plurality of metal films in the second region and a sealing film. The plurality of metal films includes at least one of Group 1 metal elements and Group 2 elements, and the leveling film is arranged so as to be confined in the first region.