A solar cell module according to the present disclosure includes a first substrate, a second substrate, a solar cell, an intermediate layer, and a first sealing layer. The first sealing layer is disposed between a peripheral portion of the first substrate and a peripheral portion of the second substrate and seals the solar cell and the intermediate layer in an area between the first substrate and the second substrate. The solar cell has a laminate structure including a first electrode, a photoelectric conversion layer, and a second electrode. The intermediate layer is not adhered to the main surface of the solar cell. A softening temperature T1 of a material of the intermediate layer is higher than a softening temperature T2 of a material of the first sealing layer.

Provided is a photovoltaic module, including: a substrate, at least one solar cell string and a packaging portion, wherein a bottom of the packaging portion has a packaging slot, the substrate and the at least one solar cell string are arranged in the packaging slot, the at least one solar cell string is arranged on a top surface of the substrate, a packaging gap is formed between a side surface of the substrate and a side surface of the packaging slot, a first packaging layer is arranged in the packaging gap, and the first packaging layer is configured to seal the packaging gap.

Provided is a photovoltaic module, including: a substrate, at least one solar cell string and a packaging portion, wherein a bottom of the packaging portion has a packaging slot, the substrate and the at least one solar cell string are arranged in the packaging slot, the at least one solar cell string is arranged on a top surface of the substrate, a packaging gap is formed between a side surface of the substrate and a side surface of the packaging slot, a first packaging layer is arranged in the packaging gap, and the first packaging layer is configured to seal the packaging gap.

A device includes a first substrate, a silicon layer supported by the first substrate, and an active glass layer with a layer including a crystal material with a chemical formula ABX.sub.3 supported by a glass substrate. The active glass layer is stacked on the first substrate such that the layer including the crystal material with a chemical formula ABX.sub.3 and silicon layer are arranged between the first substrate and the glass substrate.

A device includes a first substrate, a silicon layer supported by the first substrate, and an active glass layer with a layer including a crystal material with a chemical formula ABX.sub.3 supported by a glass substrate. The active glass layer is stacked on the first substrate such that the layer including the crystal material with a chemical formula ABX.sub.3 and silicon layer are arranged between the first substrate and the glass substrate.

An organic light emitting display device including a dam structure disposed in a non-display area of a substrate and an alignment mark disposed outside the dam structure. The alignment mark is not covered by, and does not overlap with, the dam structure, because the alignment mark is disposed outside the dame structure. Thus, a scribing process may be performed smoothly.

Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.

An electronic device, such as, without limitation, a perovskite solar cell or a light emitting diode, includes an assembly including at least one electronic portion or component, and a composite coating layer covering at least part of the assembly including the at least one electronic portion or component. The composite coating layer includes a polymer material, such as, without limitation, PMMA or PMMA-PU, having nanoparticles, such as, without limitation, reduced graphene oxide or SiO.sub.2, embedded therein. The electronic device may further include a second coating layer including a second polymer material (such as, without limitation, PMMA or PMMA-PU without nanoparticles) positioned between the coating layer and the assembly.

The present disclosure may provide semiconductor perovskite layers and method of making thereof. In some cases, the perovskite layer may comprise a composition of MA.sub.n1FA.sub.n2Cs.sub.n3PbX.sub.3. MA may be methylammonium, FA may be formamidinium, n1, n2, and n3 may independently be greater than 0 and less than 1, and n1 + n2 + n3 may equal 1.

The present disclosure may provide semiconductor perovskite layers and method of making thereof. In some cases, the perovskite layer may comprise a composition of MA.sub.n1FA.sub.n2Cs.sub.n3PbX.sub.3. MA may be methylammonium, FA may be formamidinium, n1, n2, and n3 may independently be greater than 0 and less than 1, and n1 + n2 + n3 may equal 1.