Patent classifications
H10K50/88
Film package and display device including film package
A film package includes a base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other. First pad wires are disposed on the first portion of the bottom surface of the base substrate. Second pad wires are disposed on the second portion of the bottom surface of the base substrate. A light blocking member is disposed between the first pad wires and the second pad wires.
Light-emitting device
A light-emitting unit (140) is formed over a first surface (102) of a substrate (100). A first terminal (112) and a second terminal (132) are formed on the first surface (102) of the substrate (100), and are electrically connected to the light-emitting unit (140). A sealing layer (200) is formed over the first surface (102) of the substrate (100), and seals the light-emitting unit (140). In addition, the sealing layer (200) does not cover the first terminal (112) and the second terminal (132). A cover layer (210) is formed over the sealing layer (200), and is formed of a material different from that of the cover layer (210). In at least a portion of a region located next to the first terminal (112) and a region located next to the second terminal (132), a portion of an end of the cover layer (210) protrudes from the sealing layer (200).
Organic light emitting diode and arrangement having an organic light emitting diode
In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. The connector (3) has two main sides (32) situated opposite one another that each have at least two electrical contact pads (31) of the connector (3) located on them. As seen in a cross section perpendicular to the main sides (32) and perpendicular to an insertion direction (x) of the connector (3), the contact pads (31) are arranged both geometrically and with electrical point symmetry, so that incorrect-polarity protection against incorrect electrical connection of the organic light emitting diode (1) is attained.
Organic light-emitting device
The invention relates to an organic light-emitting component which has an organic functional layer stack (3) having at least one light-emitting layer, which is designed to generate light during operation of the component, a transparent first electrode (2) and a transparent second electrode (4), which are designed to inject charge carriers into the organic functional layer stack (3) during operation, and a heat distribution layer (9), which is applied over the electrodes (2, 4) and the organic functional layer stack (3) and which has at least one plastic layer (10) and a highly heat conductive layer (11), wherein the heat distribution layer (9) has at least one transparent sub-region (91) and at least one non-transparent sub-region (92).
Lighting apparatus using organic light emitting diode
A lighting apparatus using an organic light emitting diode according to the present disclosure is configured such that a substrate is planarized by forming an anti-scratch layer on a cathode electrode to fully cover the cathode electrode. The present disclosure having such configuration can uniformly maintain pressing pressure by virtue of the anti-scratch layer even while winding or unwinding the substrate for pulse aging, thereby preventing damages due to scratches or particles.
TRANSPARENT ORGANIC ELECTROLUMINESCENCE ELEMENT
An object of the present invention is to provide a transparent organic electroluminescence element in which durability is excellent, a transparent lead-out electrode of low resistance is provided, and there is no uncomfortable feeling in visibility of the entire element. The transparent organic electroluminescence element according to the present invention is a transparent organic electroluminescence element including: at least an organic electroluminescence element portion and a lead-out electrode portion, in which two-sided light emission is capable of being performed, wherein a total light transmittance (%) of the lead-out electrode portion in a visible light range is in a range of 90% to 110%, with respect to a total light transmittance (%) of the organic electroluminescence element portion in a visible light range at the time of non-light emission.
LED device, LED driver, and driving method
An LED device comprises a substrate and a stack of layers defining an LED component and including an electroluminescent layer. A capacitive structure is formed on top of the stack of layers. The area of the defined capacitor encodes information concerning the electrical characteristics of the LED component.
DISPLAY DEVICE AND DISPLAY PANEL
The present disclosure relates to a display panel and a display device that have a pad structure including a defect detection pad and configured to be suitable for a structure in which a gate driving panel circuit is disposed. The display panel and the display device provide advantages of detecting in advance a possibility that a defect accident may occur in the display panel and preventing such a defect accident in the display panel.
DISPLAY DEVICE AND DISPLAY PANEL
The present disclosure relates to a display panel and a display device that have a pad structure including a defect detection pad and configured to be suitable for a structure in which a gate driving panel circuit is disposed. The display panel and the display device provide advantages of detecting in advance a possibility that a defect accident may occur in the display panel and preventing such a defect accident in the display panel.
Display device including connection pad part and electronic component connected to connection pad part
A display device includes a display substrate, a signal pad part, an insulating layer, a connection pad part, and an electronic component. The signal pad part includes first and second signal pad parts, which face each other in one direction. The insulating layer covers the signal pad part. The connection pad part is disposed on the insulating layer and includes a first connection pad part overlapping the first signal pad part and a second connection pad part. The second connection pad part is electrically connected to the first connection pad part and is in electrical contact with the second signal pad part through a contact hole defined in the insulating layer. The electronic component includes a bump that is in electrical contact with the first connection pad part. The first signal pad part includes a plurality of signal pad portions spaced apart from each other.