According to a lighting apparatus of the present disclosure, an organic light emitting material and a metal layer may be deposited in a state that an edge region of a film being transported is blocked by a shielding member not to form an organic light emitting layer and a second electrode in a region on which a pad is formed. A lighting apparatus may be completed by separating the film as it is cut in a width direction, wherein the organic light emitting layer and the second electrode are exposed to the outside through the cut surface, and an open region from which the organic light emitting layer and the second electrode are removed in parallel to both cut surfaces may be formed within the lighting apparatus spaced apart from the cut surface of the film to disconnect the organic light emitting layer.

A lighting apparatus using an organic light emitting diode according to the present disclosure is configured such that a substrate is planarized by forming an anti-scratch layer on a cathode electrode to fully cover the cathode electrode.

The present disclosure having such configuration can uniformly maintain pressing pressure by virtue of the anti-scratch layer even while winding or unwinding the substrate for pulse aging, thereby preventing damages due to scratches or particles.

Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.

An organic light-emitting component includes an organic light-emitting diode which has at least one organic layer arranged to generate light and a printed circuit board with electrical conductor tracks. The printed circuit board is an integral component of the organic light-emitting diode. At least one of the electrical conductor tracks of the printed circuit board is connected in electrically conductive manner to the organic layer of the organic light-emitting diode. The printed circuit board is electrically contactable from the side remote from the organic light-emitting diode.

A display device includes: a substrate including a display area and a pad area located outside of the display area; reflective electrodes including a pad reflective electrode disposed in the pad area disposed on the substrate and spaced apart from each other; an inorganic layer disposed over the reflective electrodes; first pixel electrodes including a pad pixel electrode disposed in the pad area disposed on the first inorganic layer,; a pixel defining layer including a first opening above each of the first pixel electrodes disposed in the display area; and a separator disposed on the pixel defining layer. The inorganic layer includes a second opening extending to the pad reflective electrode. The pad pixel electrode is disposed in the second opening on the pad reflective electrode through the second opening. The separator extends to the pad area from the display area to be disposed directly on the pad pixel electrode.

A display device includes: a substrate including a display area and a pad area located outside of the display area; reflective electrodes including a pad reflective electrode disposed in the pad area disposed on the substrate and spaced apart from each other; an inorganic layer disposed over the reflective electrodes; first pixel electrodes including a pad pixel electrode disposed in the pad area disposed on the first inorganic layer,; a pixel defining layer including a first opening above each of the first pixel electrodes disposed in the display area; and a separator disposed on the pixel defining layer. The inorganic layer includes a second opening extending to the pad reflective electrode. The pad pixel electrode is disposed in the second opening on the pad reflective electrode through the second opening. The separator extends to the pad area from the display area to be disposed directly on the pad pixel electrode.

A packaged chip and a backlight module including the same are provided. The packaged chip includes a base material, a chip, and a packaging layer. The base material includes a first electrode. The chip is disposed on the base material and is electrically connected with the first electrode. The packaging layer is disposed on the base material and surrounds the chip. The base material includes a surface. A first distance is between a top surface of the chip and the surface of the base material. The surface of the base material includes a coupling portion. In a cross-sectional direction, a height or a depth of the coupling portion is less than the first distance.

A packaged chip and a backlight module including the same are provided. The packaged chip includes a base material, a chip, and a packaging layer. The base material includes a first electrode. The chip is disposed on the base material and is electrically connected with the first electrode. The packaging layer is disposed on the base material and surrounds the chip. The base material includes a surface. A first distance is between a top surface of the chip and the surface of the base material. The surface of the base material includes a coupling portion. In a cross-sectional direction, a height or a depth of the coupling portion is less than the first distance.

An organic light-emitting diode (OLED) display panel and a method of manufacturing the same are disclosed. The OLED display panel includes a base substrate and a plurality of film layers sequentially deposited on a side of the base substrate in a stacked arrangement in a first direction. The plurality of film layers includes a first planarization layer configured to initially planarize an array substrate, and a second planarization layer configured to further planarize the array substrate. The first planarization layer and the second planarization layer are made of different materials.

An organic light-emitting diode (OLED) display panel and a method of manufacturing the same are disclosed. The OLED display panel includes a base substrate and a plurality of film layers sequentially deposited on a side of the base substrate in a stacked arrangement in a first direction. The plurality of film layers includes a first planarization layer configured to initially planarize an array substrate, and a second planarization layer configured to further planarize the array substrate. The first planarization layer and the second planarization layer are made of different materials.