A display device includes a substrate including a peripheral area with an integrated circuit chip disposed therein. A first pad portion, overlaps the integrated circuit chip, and includes a plurality of first dummy terminals, and a plurality of first connecting terminals electrically connected to the integrated circuit chip. The plurality of first dummy terminals is not electrically connected to the integrated circuit chip. A second pad portion, disposed in the peripheral area, includes a plurality of second connecting terminals electrically connected to a printed circuit board. A plurality of first connecting wires electrically connect each of the plurality of first connecting terminals to one or more of the plurality of second connecting terminals. At least one of the plurality of first connecting terminals is disposed between the plurality of first dummy terminals. The plurality of first connecting wires is not electrically connected to the plurality of first dummy terminals.

A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.

An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1). Furthermore, a semiconductor component (100) comprising a contact structure (10) is specified.

According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.

A method for producing an organic light-emitting component is disclosed with providing a carrier, forming a first electrode over the carrier, forming an organic functional layer structure over the first electrode, and forming a second electrode over the functional layer structure. The first and second electrodes and the functional layer structure overlap in an optically active region which extends in the lateral direction and is embodied to generate light. In an optically inactive region extending over the carrier in the lateral direction, an electrically conductive contact layer is formed over the carrier, so that it is in direct physical and electrical contact with the first electrode and/or the second electrode. A first contact section and at least one second contact section of the layer are separated from one another by a lithographic process, so that they are electrically insulated from one another. The layer is structured by a laser beam.

A display substrate and a display device are provided. The display substrate includes a base substrate, the base substrate includes a display region and a periphery region; a plurality of data signal transmission lines, a plurality of signal output pads, a plurality of signal input pads, and a plurality of test pads are located in the periphery region; a plurality of sub-pixels and a plurality of data lines are located in the display region; the plurality of data signal transmission lines are electrically connected with at least part of the plurality of data lines; the periphery region is provided with a plurality of electrostatic release elements located between the plurality of signal output pads and the plurality of test pads, each electrostatic release element is electrically connected with one data signal transmission line and is configured to release static electricity on the data signal transmission line.

The present disclosure relates to a display device, and the display device according to an exemplary embodiment of the present inventive concept includes: a first pixel circuit portion including at least one transistor; a second pixel circuit portion including at least one transistor; a first pixel electrode electrically connected to the first pixel circuit portion; a second pixel electrode electrically connected to the second pixel circuit portion; a first data line electrically connected to the first pixel circuit portion; and a second data line electrically connected to the second pixel circuit portion, wherein the first data line and the second data line are arranged adjacent to each other along a first direction, and the second pixel electrode overlaps the first data line and the second data line in a plan view.

An organic light-emitting diode includes a substrate with a top; an organic layer on the top that generates radiation; first and second electrical contact area at or on the top that electrically contacts the diode; a holding device by which the diode is mechanically supported and electrically contacted; and a cover sheet on a side of the organic layer remote from the substrate that protects the organic layer, wherein at least one opening is in the cover sheet and the opening, in plan view, is surrounded by the cover sheet and the organic layer; the areas are located at an edge of the opening and freely accessible; the device engages through the opening; the first area has a different average distance from the opening than the second area; and the electrical areas are each arranged concentrically around the opening and partially or completely surround the opening in plan view.

The present invention relates to an organic light-emitting element and a production method thereof. Specifically, the present invention relates to an organic light-emitting element, which has excellent productivity during mass production thereof and may allow simplification of vapor deposition equipment, and the like, and a production method thereof.

An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1).

Furthermore, a semiconductor component (100) comprising a contact structure (10) is specified.