A display device includes a substrate including a peripheral area with an integrated circuit chip disposed therein. A first pad portion, overlaps the integrated circuit chip, and includes a plurality of first dummy terminals, and a plurality of first connecting terminals electrically connected to the integrated circuit chip. The plurality of first dummy terminals is not electrically connected to the integrated circuit chip. A second pad portion, disposed in the peripheral area, includes a plurality of second connecting terminals electrically connected to a printed circuit board. A plurality of first connecting wires electrically connect each of the plurality of first connecting terminals to one or more of the plurality of second connecting terminals. At least one of the plurality of first connecting terminals is disposed between the plurality of first dummy terminals. The plurality of first connecting wires is not electrically connected to the plurality of first dummy terminals.

A display device according to an embodiment includes a display area and a pad area, a first insulating layer on the substrate, a second insulating layer on the first insulating layer, and a first opening adjacent to a contact portion of the pad area and a well portion surrounding the contact portion, a pad on the first insulating layer and including a first conductive layer, an organic layer in the well portion, and a third insulating layer on the second insulating layer and the organic layer, and covering the first conductive layer and the organic layer around the contact portion, wherein the first conductive layer includes a first portion in the first opening, a second portion extending from the first portion to an edge of the contact portion, and a third portion extending from the second portion into the well portion, and the organic layer covers the third portion.

A display device according to an embodiment includes a display area and a pad area, a first insulating layer on the substrate, a second insulating layer on the first insulating layer, and a first opening adjacent to a contact portion of the pad area and a well portion surrounding the contact portion, a pad on the first insulating layer and including a first conductive layer, an organic layer in the well portion, and a third insulating layer on the second insulating layer and the organic layer, and covering the first conductive layer and the organic layer around the contact portion, wherein the first conductive layer includes a first portion in the first opening, a second portion extending from the first portion to an edge of the contact portion, and a third portion extending from the second portion into the well portion, and the organic layer covers the third portion.

The present invention relates to an organic light-emitting element and a production method thereof. Specifically, the present invention relates to an organic light-emitting element, which has excellent productivity during mass production thereof and may allow simplification of vapor deposition equipment, and the like, and a production method thereof.

A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.

A method of operating an organic light-emitting component having first and second electrodes that have arranged between them an organic functional layer stack having at least one organic light-emitting layer that, during operation, produces light emitted via a luminous area, the first and second electrodes and the organic functional layer stack are in an extensive form, in contact with the first electrode, at each of two opposite edges of the first electrode a respective conductor track is arranged that extends in a longitudinal direction along the respective edge, the two conductor tracks have contact made with them on a same side of the first electrode by a connection element so that during operation there is a voltage drop in each conductor track in the longitudinal direction, which voltage drop brings about a luminous density gradient on the luminous area in a direction following the longitudinal direction.

In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. The connector (3) has two main sides (32) situated opposite one another that each have at least two electrical contact pads (31) of the connector (3) located on them. As seen in a cross section perpendicular to the main sides (32) and perpendicular to an insertion direction (x) of the connector (3), the contact pads (31) are arranged both geometrically and with electrical point symmetry, so that incorrect-polarity protection against incorrect electrical connection of the organic light emitting diode (1) is attained.

The device for charge carrier modulation is a current-controlled component, which has semiconductor layers arranged on top of each other. The organic semiconductor layers arranged on top of each other are an electron transport layer, which is arranged between a first and a second hole transport layer, and/or a hole transport layer, which is arranged between a first and a second electron transport layer. The respective central layer is the modulation layer having a contact for a modulation voltage. By applying a modulation voltage, a modulation current flow is generated over the modulation layer. The modulation current flow influences the component current flow which flows from the first into the second hole or electron transport layer via the respective modulation layer.

A display device including a substrate, a first upper power line, a conductive member, a protective insulating layer, an upper connection member, and a sub-pixel structure. The upper connection member is disposed in a first pad area and a first peripheral area on a planarization layer, and electrically connects the first upper power line and the conductive member through a first contact hole, which is formed in the protective insulating layer and the planarization layer located on the conductive member, and a second contact hole, which is formed in the protective insulating layer and the planarization layer located on the first upper power line.

An organic light emitting device includes a base substrate defining an active area and a pad area that surrounds the active area, an organic light emitting layer formed on the active area, a first protective layer formed to cover the active area, where the organic light emitting layer is formed, and the pad area, a second protective layer formed to cover the first protective layer, and a dam formed between the first protective layer and the second protective layer, wherein the dam is located at a boundary between the active area and the pad area and includes a groove that is positioned separate from an outer portion of the active area.