According to one embodiment, a display device includes a first insulating member disposed surrounding a display area, a second insulating member disposed to be spaced apart from the first insulating member and surrounding the first insulating member, an auxiliary member disposed on the second insulating member and an sealing layer. The sealing layer includes a first inorganic sealing layer disposed in a region surrounded by the second insulating member, a first organic sealing layer disposed in a region surrounded by the first insulating member, a second inorganic sealing layer disposed in an region surrounded by the second insulating member and a second organic sealing layer which covers the second inorganic sealing layer.

According to one embodiment, a display device includes a first insulating member disposed surrounding a display area, a second insulating member disposed to be spaced apart from the first insulating member and surrounding the first insulating member, an auxiliary member disposed on the second insulating member and an sealing layer. The sealing layer includes a first inorganic sealing layer disposed in a region surrounded by the second insulating member, a first organic sealing layer disposed in a region surrounded by the first insulating member, a second inorganic sealing layer disposed in an region surrounded by the second insulating member and a second organic sealing layer which covers the second inorganic sealing layer.

A display panel includes a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer, and an encapsulation layer disposed on the light emitting element layer. The encapsulation layer includes a first inorganic layer that includes a lower layer and an upper layer disposed on the lower layer, and a second inorganic layer disposed on the first inorganic layer. The lower layer includes a barrier layer that includes a silicon oxide, and the upper layer includes a silicon oxycarbide.

A display panel includes a base layer, a circuit layer disposed on the base layer, a light emitting element layer disposed on the circuit layer, and an encapsulation layer disposed on the light emitting element layer. The encapsulation layer includes a first inorganic layer that includes a lower layer and an upper layer disposed on the lower layer, and a second inorganic layer disposed on the first inorganic layer. The lower layer includes a barrier layer that includes a silicon oxide, and the upper layer includes a silicon oxycarbide.

The present disclosure provides a mask and a manufacturing method thereof, an evaporation method and a display screen, to achieve normal display of an area around such components as an earpiece, a front camera, and sensors on the front of a display screen, and increase the screen-to-body ratio. The mask comprises a substrate provided with at least one opening, an orthographic projection of the opening on a display plane of a display screen to be fabricated coinciding with a display area of the display screen to be fabricated; a shielding part arranged inside the opening, an orthographic projection of the shielding part on the display plane coinciding with an orthographic projection of a component to be shielded in the display screen to be fabricated on the display plane; and a connecting part located between the shielding part and a side wall of the opening.

An electronic device may include an organic light emitting display (OLED), a heat generating device, and a heat spreading device. The heat generating device may provide heat directly to the heat spreading device, and the heat spreading device is to dissipate the heat from the heat generating device and evenly heat the OLED and lower a driving voltage of the OLED to reduce power consumption of the OLED.

An electronic device may include an organic light emitting display (OLED), a heat generating device, and a heat spreading device. The heat generating device may provide heat directly to the heat spreading device, and the heat spreading device is to dissipate the heat from the heat generating device and evenly heat the OLED and lower a driving voltage of the OLED to reduce power consumption of the OLED.

An electronic substrate and an electronic device are provided. The electronic substrate includes a base substrate, and a first signal line and a second signal line on the base substrate; the electronic substrate includes a first functional region and a peripheral region, and the first signal line and the second signal line are in the peripheral region; at least one of the first signal line and the second signal line is configured to transmit an electrical signal for the first functional region; in a direction perpendicular to the base substrate, the first signal line partially overlaps with the second signal line in an overlapping region; and the first signal line includes a first wiring portion in the overlapping region and a second wiring portion outside the overlapping region, and a line width of the first wiring portion is different from a line width of the second wiring portion.

An electronic substrate and an electronic device are provided. The electronic substrate includes a base substrate, and a first signal line and a second signal line on the base substrate; the electronic substrate includes a first functional region and a peripheral region, and the first signal line and the second signal line are in the peripheral region; at least one of the first signal line and the second signal line is configured to transmit an electrical signal for the first functional region; in a direction perpendicular to the base substrate, the first signal line partially overlaps with the second signal line in an overlapping region; and the first signal line includes a first wiring portion in the overlapping region and a second wiring portion outside the overlapping region, and a line width of the first wiring portion is different from a line width of the second wiring portion.

An electronic device includes: a substrate; a conductive layer disposed on the substrate, wherein the conductive layer includes a plurality of branch portions; a plurality of bonding pads respectively disposed on the plurality of branch portions of the conductive layer; and an insulating layer disposed between the conductive layer and the plurality of bonding pads.