An object is to provide a light-emitting module in which a light-emitting element suffering a short-circuit failure does not cause wasteful electric power consumption. Another object is to provide a light-emitting panel in which a light-emitting element suffering a short-circuit failure does not allow the reliability of an adjacent light-emitting element to lower. Focusing on heat generated by a light-emitting element suffering a short-circuit failure, provided is a structure in which electric power is supplied to a light-emitting element through a positive temperature coefficient thermistor (PTC thermistor) thermally coupled with the light-emitting element.

In a method for imprinting optoelectronic components with at least one bus bar, the bus bar following the shape of the optoelectronic component and allowing a homogeneous color impression on the rear face of the component, the bus bar is printed on a basic material before deposition of a photoactive layer. The basic material may comprise a substrate, or an electrically conductive transparent layer on a substrate. Subsequently, a conductive layer on the substrate is structured to form isolated regions, the photoactive layer is deposited and structured, and then a counter electrode is applied and structured.

In various exemplary embodiments, an optoelectronic component device is provided. The optoelectronic component device includes a first organic light emitting diode and a second organic light emitting diode, which are connected to one another in physical contact one above the other. The first organic light emitting diode is electrically connected in parallel with the second organic light emitting diode. The first organic light emitting diode and the second organic light emitting diode have at least an approximately identical or identical electronic diode characteristic and/or an approximately identical or identical electronic diode characteristic variable.

In some embodiments of the disclosed subject matter provides an active matrix organic light emitting diode array substrate, comprising; multiple pixel units in an array on a base substrate, adjacent pixel units are separated by a pixel defining layer, each pixel unit comprises a thin film transistor and an organic light emitting diode; an insulating layer between a source/drain electrode layer of the thin film transistor and an electrode layer of the organic light emitting diode; the insulating layer includes a via hole therein, the electrode layer comprises a recess part connecting with the source/drain electrode layer in the via hole; and a filling layer on the recess part for preventing an organic light emitting layer of the organic light emitting diode being inside of the recess part, the pixel defining layer and an organic light emitting layer of the organic light emitting diode are overlaid on the filling layer.

A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An underfill is positioned inboard of the frame. The package plate has a spreading surface, and at least one groove is formed in a spreading path of the frame on the spreading surface of the package plate.

OLED panels and techniques for fabricating OLED panels are provided. Multiple cuts may be made in an OLED panel to define a desired shape, as well as the location and shape of external electrical contacts. The panel may be encapsulated before or after being cut to a desired shape, allowing for greater flexibility and efficiency during manufacture.

A display panel and a display device. The display panel includes a first display area, a second display area and a transition display area between the first display area and the second display area. A light transmittance of the first display area is greater than a light transmittance of the second display area. The display panel includes a plurality of columns of first sub-pixels disposed in the transition display area arranged in a first direction, and each column of sub-pixels includes a plurality of first sub-pixels arranged in a second direction which intersects the first direction. A plurality of first pixel circuits corresponding to at least one column of first sub-pixels are distributed on a same column.

The application relates to the field of OLED lighting, and provides a high-yield low-cost large-area flexible OLED lighting module, a manufacturing method thereof and an OLED lighting luminaire.

An end (that is, an end (130b)) of a second electrode (130) of a k-th light-emitting unit (152(k)) on a second side (S2) exists on the outer side of an end (152b) of the k-th light-emitting unit (152(k)) by the width WR(k) of an overlapping region (OR). In one example, the width WR(k) is equal to or greater than d×tan(arcsin(sin θl(k)/ns)) and equal to or less than 3d×tan(arcsin(sin θl(k)/ns)) (d×tan(arcsin(sin θl(k)/ns))≤WR(k)≤3d×tan(arcsin(sin θl(k)/ns))).

To provide a display device that is suitable for increasing in size, a display device in which display unevenness is suppressed, or a display device that can display an image along a curved surface. The display device includes a first display panel and a second display panel each including a pair of substrates. The first display panel and the second display panel each include a first region which can transmit visible light, a second region which can block visible light, and a third region which can perform display. The third region of the first display panel and the first region of the second display panel overlap each other. The third region of the first display panel and the second region of the second display panel do not overlap each other.