Provided is a display substrate, a preparation method thereof and a display apparatus. The display substrate includes a base substrate, which has a display area and an encapsulation area, the encapsulation area surrounds the display area, and a hydrophobic structure is arranged on the encapsulation area.

The present disclosure relates to an organic light emitting diode display panel and a method of manufacturing the organic light emitting diode display panel. A display panel, including: a plurality of first light emitting layers arranged in an array in a first direction and a second direction; and a pixel defining layer including a plurality of first openings, wherein each first opening has a reduced size in the first direction, so that the corresponding first light emitting zone defined by the first opening has a first misalignment tolerance range in the first direction, and has a second misalignment tolerance range in the second direction, the corresponding first light emitting zone is allowed to shift in the first direction within the first misalignment tolerance range without overlapping the shaded region of the corresponding first light emitting layer.

This invention generally relates to a method for preparing and transferring a monolayer or thin film. In particular this present invention is an improved version of the Langmuir-Schaefer technique for preparing and transferring a monolayer or thin film, incorporating in situ thermal control of the substrate during the transfer process.

The present disclosure relates to a plurality of host materials comprising at least one first host compound and at least one second host compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of the compounds wherein the first host compound is represented by formula 1 and the second host compound is represented by formula 2, it is possible to provide an organic electroluminescent device having improved driving voltage, luminous efficiency, power efficiency and/or lifetime property.

A method of manufacturing a fluorescent substance may include forming dicing trenches on one surface of a fluorescent substance wafer along grid-type dicing lines, filling the dicing trench with an adhesive material having fluidity, curing the adhesive material, reducing a thickness of a surface opposite to the one surface on which the dicing trenches are formed to make an integrated form of a plurality of individual fluorescent substances, which are divided along the dicing lines, with the adhesive material connecting therebetween, and removing the adhesive material to remain only the divided individual fluorescent substances.

A display panel includes a substrate including a central area and a corner area on an outer side of the central area, a plurality of pixels arranged on the substrate and including a first pixel, a second pixel, a third pixel, and a fourth pixel which overlap the corner area, and an inorganic layer defining a first opening, which is arranged between the first pixel and the second pixel, and a second opening, which is arranged between the third pixel and the fourth pixel, where a shape of the first opening is different from a shape of the second opening.

The present disclosure provides an organic thin film and a method for preparing the same, a display device, and an optical device, in which the method includes: providing a base substrate; forming an isomerization generating layer on the base substrate, the isomerization generating layer including a first region and a second region; adding a precursor solution on a surface of the isomerization generating layer away from the base substrate, and allowing surface energy of the second region to be greater than surface energy of the first region, so as to form the organic thin film from the precursor solution, the precursor solution being at least partially located in the second region.

Provided are compounds, formulations comprising compounds, and devices that utilize compounds, where the devices include a substrate, a first electrode, an organic emissive layer comprising an organic emissive material disposed over the first electrode. The device includes an enhancement layer, comprising a plasmonic material exhibiting surface plasmon resonance that non-radiatively couples to the organic emissive material and transfers excited state energy from the organic emissive material to the non-radiative mode of surface plasmon polaritons. The enhancement layer is provided no more than a threshold distance away from the organic emissive layer, where the organic emissive material has a total non-radiative decay rate constant and a total radiative decay rate constant due to the presence of the enhancement layer. At least one of the organic emissive material and the organic emissive layer has a vertical dipole ratio (VDR) value of equal or greater than 0.33.

An inkjet composition for an inkjet printer, a light-emitting device including the same, and a method of manufacturing the light-emitting device are provided. The ink composition may include light-emitting diodes and a solvent. The solvent may have a first viscosity at a first temperature section that may be greater than a second viscosity at a second temperature section. The solvent may include an ester compound of citric acid, glycol, alkanediol, alkanolamine, alkenic acid, alkenol, a pyrrolidone group-containing compound, glycerol, a compound represented by Formula 1, a compound represented by Formula 2, or any combination thereof: ##STR00001##
Substituents in Formula 1 and Formula 2 may be understood as described in connection with the detailed description. Each of the light-emitting diodes may have a size in a range of about 0.1 μm to about 10 μm.

A method for making a strain sensor is provided. The method includes growing an iron (Fe) thin seed layer with patterns on a top surface of a silicon oxide isolation layer formed on a top surface of a silicon wafer; synthesizing a plurality of vertically aligned carbon nanotubes (VACNTs) on top surfaces of the iron (Fe) thin seed layer to form electrodes of the strain sensor;

forming a first polydimethylsiloxane (PDMS) layer disposed on and between adjacent VACNTs of the plurality of VACNTs; peeling the first PDMS layer and the plurality of VACNTs embedded in the first PDMS layer off from the top surface of the silicon oxide isolation layer; and forming a second PDMS layer on a bottom surface of the plurality of VACNTs embedded in the first PDMS layer.