A method for the contacting of electrodes with conductor tracks by means of a conductive paste and/or adhesive-coated conductive fiber composites is provided. Furthermore, an electronic component whose electrodes are connected by means of a conductive paste and/or adhesive-coated conductive fiber composites is provided.

The present disclosure provides a display device and a method for preparing the same. The display device includes a first base; a transparent electrode arranged on the first base; a display substrate arranged on a side of the first base proximate to the transparent electrode and opposite to the first base, the display substrate comprising a cathode located on a side of the display substrate proximate to the first base; and a supporting body located between the transparent electrode and the cathode and configured to electrically conduct the transparent electrode and the cathode.

The present application discloses a display panel including a base substrate and a pixel-defining layer on a surface on the base substrate to define multiple subpixel regions arranged in multiple rows with each subpixel region surrounded by part of the pixel-defining layer. The pixel-defining layer includes one or more grooves. Each groove includes a container portion partially surrounded by an edge portion. The container portion is at a first height above the surface and the edge portion is at a second height greater than the first height relative to the surface. The edge portion of each groove includes one or more gaps to allow the container portion to connect to one or more subpixel regions respectively in one or two rows at one or both sides of the groove.

The present disclosure provides an array substrate, a method for manufacturing the same, and a display device. The array substrate includes a substrate, a first dielectric layer disposed on the substrate, the first dielectric layer having recesses, a first conductive layer covering the first dielectric layer, and auxiliary conductive portions disposed at in the recesses and contacting the first conductive layer.

A method, system, apparatus, and/or device to creating a set of miniaturized electrode pillars. The method, system, apparatus, and/or device may include patterning a set of miniaturized electrode pillars on a substrate and coating the set of miniaturized electrode pillars with an interstitial filler disposed between the set of miniaturized electrode pillars. The interstitial filler may insulate the set of miniaturized electrode pillars from each other and bolster the set of miniaturized electrode pillars.

Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

A transparent display substrate, a manufacturing method thereof, and a transparent display device are disclosed. The transparent display substrate includes a base substrate and a pixel defining layer defining a plurality of pixel regions on the base substrate; at least one of the pixel regions includes a light-transmitting portion and a light-emitting portion, and is provided with an OLED layered portion and an auxiliary electrode; the OLED layered portion includes a reflective anode, an organic light-emitting layer and a transmissive cathode; and the auxiliary electrode is located in the light-transmitting portion, disposed at a side of the transmissive cathode close to the base substrate, and connected to the transmissive cathode.

There provide an organic light emitting diode substrate and preparation method thereof and a display panel. The preparation method includes: forming a pixel defining layer which defines a pixel region and has a via hole on a base; forming an auxiliary electrode in the via hole; forming a capsule structure encapsulating a conductive liquid on the auxiliary electrode; expanding the capsule structure to be broken so as to enable the conductive liquid to form a connection electrode; and forming a first electrode covering the base, the first electrode being connected to the auxiliary electrode through the connection electrode. In the present disclosure, the connection electrode is formed through the capsule structure encapsulating the conductive liquid, so that the first electrode is connected to the auxiliary electrode through the connection electrode. The preparation process is simpler and the production cost is lower.

An organic light emitting diode display is provided including a first display panel. The first display panel includes a first substrate and a transistor disposed on the first substrate. The transistor includes an input electrode and an output electrode. A second display panel is provided including a second substrate, a first electrode disposed on the second substrate, an emission layer disposed on the first electrode, and a second electrode disposed on the emission layer. A first connector is disposed on the output electrode and between the first display panel and the second display panel. The second display panel further includes a first opening formed in the second substrate and a pixel electrode connector disposed in the first opening. The output electrode of the transistor is electrically connected to the first electrode through the first connector, and the first electrode and the first connector are electrically connected through the pixel electrode connector.

The present disclosure relates to OLED and PV devices including transparent electrodes that are formed of conductive nanostructures and methods of improving light out-coupling in OLED and input-coupling in PV devices.