The present application provides an array substrate and a method of fabricating the same, a display panel and a display device. The array substrate is divided into a plurality of pixel regions, and each of the pixel regions is provided with a pixel thin film transistor (TFT). At least one of the pixel regions is provided with a pressure component and a force TFT, the force TFT includes a first electrode, a second electrode and a control electrode, and the pressure component is connected to one of the first electrode and the control electrode of the force TFT. At least one of layer structures of the pixel TFT is disposed in the same layer as a corresponding layer structure of the force TFT.

The invention provides nickel oxide films and preparation method thereof. The nickel oxide film includes: a nickel oxide film layer; organic molecules having electron withdrawing groups, the organic molecules being bonded to and disposed on the surface of the nickel oxide film layer.

The present invention relates to a method for forming an organic EL element having at least one pixel type comprising at least three different layers including a hole injection layer (HIL), a hole transport layer (HTL) and an emission layer (EML), characterized in that the HIL, the HTL and the EML of at least one pixel type are obtained by depositing inks wherein the layers are annealed after said depositing steps in a first, second and third annealing step and the difference of the annealing temperature of the first and of the second annealing step is below 35° C., preferably below 30° C., more preferably below 25° C. and the annealing temperature of the third annealing step is no more than 5° C. above the annealing temperature of the first and/or the second annealing step, preferably the annealing temperature of the third annealing step is equal to or below the annealing temperature of the first and the second annealing step, wherein the first annealing step is performed before the second annealing step and the second annealing step is performed before the third annealing step.

A bottom protection film for an OLED panel is provided. More particularly, a bottom protection film for an OLED panel, the bottom protection film having excellent bending performance due to elasticity and impact resistance, excellent alignment process workability, and excellent adhesion to an OLED panel, and being capable of preventing generation of static electricity through performing an antistatic treatment is provided.

The present disclosure provides a pixel defining layer, a display substrate and manufacturing methods thereof, and relates to the field of display technology. The pixel defining layer is located on a base substrate, and configured to define a plurality of pixel regions. The pixel defining layer includes: a defining layer body, and a heat generating substance located in the defining layer body. The heat generating substance is configured to cause a temperature on a side of the defining layer body proximal to the base substrate to be lower than a temperature on a side of the defining layer body distal from the base substrate.

An organic light emitting diode display includes a substrate including a display area and a pad area, a first thin film transistor disposed on the display area, an organic light emitting diode connected to the first thin film transistor, a pad electrode disposed on the pad area and a pad contact electrode disposed on an upper portion of the pad electrode and electrically connected to the pad electrode. The organic light emitting diode includes an anode, an organic emission layer, and a cathode. The anode includes a lower layer, an intermediate layer, and an upper layer. The pad contact electrode is formed of a material of the lower layer of the anode.

A composition for a light-emitting element contains a host material and a guest material. The host material is a compound containing at least one of an aromatic hydrocarbon group and a heterocyclic group and the guest material is a compound having a condensed heterocyclic group containing at least one of a boron atom, an oxygen atom, a sulfur atom, a selenium atom, an sp.sup.3 carbon atom, and a nitrogen atom in a ring. A difference ΔE between an energy value at the maximum peak of a emission spectrum of the host material at 25° C. and an energy value at a peak on the lowest energy side of an absorption spectrum of the guest material at 25° C. is 0.50 eV or less, and a difference ΔS between an energy value at the maximum peak of an emission spectrum of the guest material at 25° C. and an energy value at the maximum peak of an emission spectrum of the guest material at 77 K is 0.10 eV or less.

The present invention relates to an ink composition for an organic light emitting device that can be applied to an inkjet process. The ink composition comprises a compound represented by the following Chemical Formula 1, a first solvent of aromatic esters having a boiling point of 260 to 400° C., and a second solvent of aliphatic ethers or aliphatic esters having a boiling point of 200 to 400° C., wherein the boiling point of the first solvent is higher than that of the second solvent. When this is applied to an inkjet process, it can form a flat film with a smooth surface when dried after forming the ink film.

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wherein L, L.sub.1 to L.sub.4, Ar.sub.1, Ar.sub.2, R.sub.1 to R.sub.4, Y.sub.1 to Y.sub.4, and n.sub.1 to n.sub.4 are described herein.

A method of manufacturing an organic light-emitting device includes a heat treatment performed at a set or predetermined temperature range when forming a hole transport layer utilizing a solution process. When an emission layer is formed thereon utilizing a solution process, a mixed layer may be formed to a suitable thickness for improving hole injection into the emission layer. An organic light-emitting device may be manufactured utilizing the method.

A display panel and a manufacturing thereof, including a substrate, a pixel defining layer, an auxiliary electrode layer, an electron transport layer, a cathode layer, an organic layer, and a metal layer. The pixel defining layer includes a plurality of pixel openings. The auxiliary electrode layer includes a first auxiliary electrode sublayer and a second auxiliary electrode sublayer sequentially disposed on the pixel defining layer. The first auxiliary electrode sublayer is provided with a groove portion. The metal layer is disposed between the second auxiliary electrode sublayer and the cathode layer and corresponding to the groove portion.