Patent classifications
H10N10/17
FLEXIBLE THERMOELECTRIC DEVICE
The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.
THERMOELECTRIC MODULE AND A VEHICLE INCLUDING THE SAME
A thermoelectric module includes a first electrode, a first oxidation preventing layer, a plurality of first bonding layers containing silver (Ag), a second oxidation preventing layer, a first plating layer, a thermoelectric element, a second plating layer, a third oxidation preventing layer, a second bonding layer containing silver (Ag), a fourth oxidation preventing layer, and a second electrode.
Systems and Methods for Thermoelectric Body Cooling
Multiple embodiments of a system are disclosed to draw heat away from the body through the palm, back of the hand, or forehead using a thermoelectric device. In doing so, the core body temperature may be lessened, allowing for quicker muscle recovery and better physical performance during exercise and/or during rest breaks between periods of exercise.
POWERING SENSOR PACKAGES IN MOVING PLATFORMS
In accordance with at least one aspect of this disclosure, a thermoelectric generator (TEG) system can include a TEG conversion element configured to be in thermal communication with a leading edge surface subject to hypersonic flow and a heatsink to generate a temperature differential across the TEG conversion element mounted between the leading edge surface and heatsink, and an electrical conductor configured to connect between the TEG conversion element and a powered unit to supply electrical energy from the TEG conversion element to the powered unit.
POWERING SENSOR PACKAGES IN MOVING PLATFORMS
In accordance with at least one aspect of this disclosure, a thermoelectric generator (TEG) system can include a TEG conversion element configured to be in thermal communication with a leading edge surface subject to hypersonic flow and a heatsink to generate a temperature differential across the TEG conversion element mounted between the leading edge surface and heatsink, and an electrical conductor configured to connect between the TEG conversion element and a powered unit to supply electrical energy from the TEG conversion element to the powered unit.
HIGH TEMPERATURE SENSOR AND SYSTEM
A sensor having thermal stability at greater than 900° C., including a sensor body comprising an energy harvesting thermal electric generator, a heat sink in thermally conductive contact with the body, and a conductor electrically attached to the body, the conductor surrounded by a ceramic dielectric material. A borehole system including a borehole in a subsurface formation, a sensor disposed in the borehole.
HIGH TEMPERATURE SENSOR AND SYSTEM
A sensor having thermal stability at greater than 900° C., including a sensor body comprising an energy harvesting thermal electric generator, a heat sink in thermally conductive contact with the body, and a conductor electrically attached to the body, the conductor surrounded by a ceramic dielectric material. A borehole system including a borehole in a subsurface formation, a sensor disposed in the borehole.
Semiconductor with coaxial P-type and N-type material
Disclosed is a thermoelectric generator including a heat source contact, a heat sink contact, and a plurality of co-axial fibers. Each of the co-axial fibers include a core and a cladding disposed about the core. The plurality of co-axial fibers extend from the heat source contact to the heat sink contact. Thermoelectric generators are disclosed including hollow core doped silicon carbide fibers and doubly clad PIN junction fibers. Methods for forming direct PN junctions between oppositely doped fibers are additionally disclosed.
Semiconductor with coaxial P-type and N-type material
Disclosed is a thermoelectric generator including a heat source contact, a heat sink contact, and a plurality of co-axial fibers. Each of the co-axial fibers include a core and a cladding disposed about the core. The plurality of co-axial fibers extend from the heat source contact to the heat sink contact. Thermoelectric generators are disclosed including hollow core doped silicon carbide fibers and doubly clad PIN junction fibers. Methods for forming direct PN junctions between oppositely doped fibers are additionally disclosed.
Thermoelectric conversion element and thermoelectric conversion module
A thermoelectric conversion element includes: a thermoelectric member that is columnar; an insulator formed around the thermoelectric member; and a metal layer formed continuously on an edge surface of the thermoelectric member and an edge surface of the insulator. An edge portion of the thermoelectric member and an edge portion of the insulator define a gap covered with the metal layer. The inner portion of the gap covered with the metal layer is a void.