Disclosed is an embodiment is a thermoelectric module comprising: a first thermally conductive plate; a thermoelectric element arranged on the first thermally conductive plate; a second thermally conductive plate arranged on the thermoelectric element; and a cover frame, which is arranged on the first thermally conductive plate, and has an accommodation space such that the thermoelectric element is accommodated in the accommodation space, wherein the thermoelectric element includes: a first substrate; a plurality of thermoelectric legs arranged on the first substrate; a second substrate arranged on the plurality of thermoelectric legs; and electrodes comprising a plurality of first electrodes arranged between the first substrate and the plurality of thermoelectric legs; and a plurality of second electrodes arranged between the second substrate and the plurality of thermoelectric legs, and the cover frame includes: an outer frame arranged to be spaced from the thermoelectric element on the first thermally conductive plate; and an upper frame extending toward the second thermally conductive plate so as to be inclined from the upper end of the outer frame toward the downward direction thereof.

An semiconductor device includes a substrate having a first surface and a second surface opposite the first surface, and a through-silicon via structure extending through the substrate. The through-silicon via structure includes a first through-silicon via containing a first conductivity type material and a second through-silicon via containing a second conductivity type material opposite the first conductivity type material. The semiconductor device also includes a first conductive layer on the first surface of the substrate and electrically coupled to a first end of the first through-silicon via and a first end of the second through-silicon via. The semiconductor device also includes a second conductive on the second surface and having a first portion coupled to a second end of the first through-silicon via and a second portion coupled to a second end of the second through-silicon via.

A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.

Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

A thermoelectric generation module has a cooling surface formed on one of a front side and a rear side and a heating surface formed on the other thereof. The thermoelectric generation module includes: a plurality of thermoelectric elements; a pair of flexible boards holding the thermoelectric elements therebetween and respectively defining the cooling surface and the heating surface; a plurality of interelement electrodes respectively provided on opposed surfaces of the flexible boards and configured to electrically connect the thermoelectric elements to each other; a lead wire configured to be electrically connected to an interelement electrode to which a terminal element located at an end of an electrical arrangement is connected; and a reinforcing pattern interposed between the flexible boards and being closer to the drawn-out lead wire with respect to the terminal element.

Protective coating to prevent sublimation are disclosed. More particularly, the protective coatings comprise one or more alkaline earth halide materials, or mixtures thereof, to prevent sublimation. The alkaline earth halide material of the coating can be judiciously selected to match the coefficient of thermal expansion (CTE) of the material of the external surface of the underlying substrate coated. The protective coatings may be advantageous for protecting external surfaces of thermoelectric materials, parts and devices at high temperature to prevent sublimation and material loss.

Protective coating to prevent sublimation are disclosed. More particularly, the protective coatings comprise one or more alkaline earth halide materials, or mixtures thereof, to prevent sublimation. The alkaline earth halide material of the coating can be judiciously selected to match the coefficient of thermal expansion (CTE) of the material of the external surface of the underlying substrate coated. The protective coatings may be advantageous for protecting external surfaces of thermoelectric materials, parts and devices at high temperature to prevent sublimation and material loss.

A thermoelectric device with multiple headers and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric device includes multiple thermoelectric legs, a cold header thermally attached to the thermoelectric legs, and a hot header thermally attached to the thermoelectric legs opposite the cold header. At least one of the cold header and the hot header includes at least one score line. According to some embodiments disclosed herein, this the thermal stress on the thermoelectric device can be greatly reduced or relieved by splitting the header into multiple pieces or by scoring the header by a depth X. This enables the use of larger thermoelectric devices and/or thermoelectric devices with an increased lifespan.

A thermoelectric converter includes a first substrate that is deformable, a second substrate that is deformable, a plurality of thermoelectric conversion elements, and a group of electrodes. The plurality of thermoelectric conversion elements are disposed between the first substrate and the second substrate. The group of electrodes electrically interconnect the plurality of thermoelectric conversion elements. The plurality of thermoelectric conversion elements are arranged in a plurality of rows. The group of electrodes include a bridge electrode disposed across a first row and a second row among the plurality of rows. The first row is adjacent to the second row. The bridge electrode has a first part whose thickness is smaller than a thickness of each of remaining electrodes other than the bridge electrode among the group of electrodes and whose surface area is larger than a surface area of each of the remaining electrodes.