A mechanical structure comprising a stack including an active substrate and at least one actuator designed to generate vibrations at the active substrate, the stack comprises an elementary structure for amplifying the vibrations: positioned between the actuator and the active substrate, the structure designed to transmit and amplify the vibrations; and comprising at least one trench, located between the actuator and the active substrate. A method for manufacturing the structure comprising the use of a temporary substrate is provided.

A bendable apparatus is provided. The flexible material has a first-surface spanned by a first direction and a second direction. The bendable apparatus also includes a first-constraining surface one of: formed in the first-surface of the flexible material; or attached to the first-surface of the flexible material; and a piezo-electric element including a first-edge surface and a second-edge surface opposing the first-edge surface. The piezo-electric element is fixedly attached on the first-surface of the flexible material, so that: the first-edge surface and the second-edge surface are at least approximately perpendicular to the first-surface of the flexible material, and the first-constraining surface is adjacent to the first-edge surface of the piezo-electric element. When a voltage is applied to the piezo-electric element, the piezo-electric element expands in length, the first-edge surface of the piezo-electric element applies a force on the first-constraining surface, and the flexible material bends.

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

To provide a tactile vibration applying device that efficiently outputs vibrations using an electrostatic or piezoelectric actuator. The tactile vibration applying device includes the electrostatic or piezoelectric actuator formed in a flat shape, and expanding and contracting in a thickness direction, a first elastic body having an elastic modulus smaller than an elastic modulus of the actuator in the thickness direction and disposed to contact a surface of the actuator on a side of the first electrode, and a first cover covering a surface of the first elastic body opposite to a surface of the first elastic body contacting the actuator, pressing the actuator and the first elastic body in the thickness direction of the actuator, and holding the first elastic body in a state that the first elastic body is compressed more than the actuator.

An electroactive polymer transducer including a dielectric elastomer material having a first configuration with a first spring constant and a second configuration with a second spring constant and where the second spring constant is lower than the first spring constant.

A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer thereby reducing or eliminating bending of the assembly as installed in an environment, thereby increasing the effective stroke length of the assembly. Poling only a single layer would induce stresses into the device; hence, polling both piezoelectric layers even though only one layer will be active in use reduces stresses in the device and therefore increases reliability.

According to various aspects and embodiments, a method for forming a packaged electronic device is provided. In accordance with one embodiment, the method comprises depositing a layer of temporary adhesive material on at least a portion of a surface of a first substrate having a coefficient of thermal expansion, depositing a layer of dielectric material on at least a portion of the layer of temporary adhesive material, forming at least one seal ring on at least a portion of the layer of dielectric material, providing a second substrate having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the first substrate, the second substrate having at least one bonding structure attached to a surface of the second substrate, and aligning the at least one seal ring to the at least one bonding structure and bonding the first substrate to the second substrate.

An ultrasound probe comprises: a backing material; a plurality of inorganic piezoelectric elements arranged on a top surface of the backing material; a first acoustic matching layer separated into a plurality of pieces disposed on the plurality of inorganic piezoelectric elements; and a second acoustic matching layer separated into a plurality of pieces disposed on the first acoustic matching layer, wherein the second acoustic matching layer comprises an upper organic layer constituting a plurality of organic piezoelectric elements, and a lower organic layer for performing, together with the upper organic layer, acoustic matching for the plurality of inorganic piezoelectric elements.

The present disclosure of at least one embodiment provides a method for manufacturing ultrasound probes comprising a machining process, the method including depoling a piezoelectric element as a material for the ultrasonic probes before the machining process.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.