An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Mg170 may be satisfied, Mg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Mg170 may be satisfied, Mg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

An ultrasound sensor includes: a diaphragm; a plurality of first electrodes; a plurality of second electrodes; and a plurality of piezoelectric layers which is provided between the first electrode and the second electrode, in which, in a Z-direction, a portion in which the first electrode, the piezoelectric layer and the second electrode are overlapped is referred to as an active portion, and a range to the extent that the diaphragm is oscillatable by driving the active portion is referred to as a movable portion, when a unit including one movable portion and the active portion which is provided within the one movable portion is referred to as one ultrasound element in plan view, two or more types of ultrasound elements in which a dimension of the active portion with respect to a dimension of the movable portion is different from each other in plan view are provided.

A piezoelectric vibration device that includes a piezoelectric vibrator having excitation electrodes formed thereon; a base having the piezoelectric vibrator on a first surface thereof; outer electrodes formed to continuously extend from the first surface of the base through a side face of the base to a second surface of the base opposite the first surface; and a lid having a recess opening that faces the first surface of the base, the lid being joined to the base to hermetically seal the piezoelectric vibrator in an internal space defined by the recess and the base. An edge portion of a corresponding one of the outer electrodes, formed by the first surface and the side face of the base, is at least partly covered by a covering member having insulating properties.

An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Mg170 may be satisfied, Mg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.

This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.

A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.

The present invention relates to a piezoelectric nanogenerator (PENG) that is capable of harvesting mechanical energy into electricity. The PENG comprises one dimensional (1D) and two dimensional (2D) nanostructures integrated together to form a composite nanostructure. A major advantage of the present invention is that the composite nanostructure provides enhanced electrical output and enhanced mechanical stability as compared to previously reported 1D or 2D nanostructures alone. Also described is a hybrid nanogenerator that combines the PENG with a triboelectric nanogenerator (TENG). A method of synthesizing the composite nanostructure PENG, in which the 1D and 2D nanostructures are grown together on the same substrate using a low temperature hydrothermal method is also described. The provided method is simple and cost-effective.

A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.