A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

A method of manufacturing a ceramic structure, a method of manufacturing a ceramic structure with multiple layers of ceramic material, and a method of manufacturing a piezoelectric ceramic structure. The method of manufacturing a ceramic structure includes the steps of: placing a sheet of ceramic material on a supporting platform, wherein the supporting platform is arranged to elevate the sheet of ceramic material from a base of the supporting platform by supporting only a first portion of the sheet of ceramic material; sintering the sheet of ceramic material; and during the step of sintering of the sheet of ceramic material, facilitating forming a curvature on the sheet of ceramic material at a second portion of the sheet of ceramic material which is not supported by the supporting platform.

This application provides a piezoelectric component, a piezoelectric apparatus and a method for manufacturing the same, and relates to the field of piezoelectric technologies. In order to solve a problem of a relatively large misalignment between a piezoelectric component and a target transfer position on a glass substrate occurred after the piezoelectric component is transferred in the related transfer methods, and to improve the transfer accuracy of the piezoelectric component. The piezoelectric component includes: a component body and at least one electrode structure arranged on a side of the component body. The at least one electrode structure includes a plurality of strip-shaped electrode pins, and the plurality of electrode pins is arranged at intervals.

A method of forming an electrode in a ceramic transducer electronic component is provided. The method includes preparing a sintered body for a ceramic transducer containing a metal oxide, performing patterning by irradiating a laser on a surface of the sintered body for a ceramic transducer, and forming a metal electrode by performing an electroless plating process on the sintered body for a ceramic transducer on which the patterning is formed, wherein, in the performing of the patterning by irradiating the laser on the surface of the sintered body for a ceramic transducer, the patterning is performed by irradiating the laser that satisfies at least one of a predetermined power condition and a predetermined processing speed condition.

A method for fabricating a piezoelectric transducer includes depositing a layer of a piezoelectric material on a base using a depositor and applying an electric field to the layer of deposited piezoelectric material in defined locations using an electrode to sinter and pole the deposited piezoelectric material at those defined locations to form a layer of the piezoelectric transducer in a selected shape and with a selected dipole direction.

There is provided a SAW filter manufacturing method for manufacturing a SAW filter from a piezoelectric substrate having planned dividing lines set on a top surface of the piezoelectric substrate, and having a device including comb-shaped electrodes in regions demarcated by the planned dividing lines. The method includes a structure forming step of forming a structure having projections and depressions on an undersurface side of the piezoelectric substrate by irradiating the piezoelectric substrate with a laser beam of a wavelength absorbable by the piezoelectric substrate from the undersurface side of the piezoelectric substrate, and a dividing step of dividing the piezoelectric substrate along the planned dividing lines after the structure forming step.

An optical element includes a primary electrode, a secondary electrode overlapping at least a portion of the primary electrode, and a structurally-modified and transparent electroactive polymer disposed between and abutting the primary electrode and the secondary electrode. An optical device may include a tunable lens and an optical element disposed over at least one surface of the tunable lens.

Described herein is an additive manufacturing apparatus that is well-suited for constructing piezoelectric sensors. The additive manufacturing apparatus includes an extrusion nozzle formed of a conductive material such as aluminum. The extrusion nozzle has a channel by way of which printing material exits the extrusion nozzle, wherein a build plate is configured to receive the printing material responsive to the printing material exiting the extrusion nozzle. An arc suppressor formed of a semiconductor is coupled to the extrusion nozzle and is configured to dissipate excess charge that would otherwise exist on the extrusion nozzle when a relatively high bias voltage is applied to the extrusion nozzle. Thus, the arc suppressor mitigates arcing between the extrusion nozzle and the build plate. Arc suppressing gas is also optionally introduced into a printing region, thereby further mitigating arcing between the extrusion nozzle and the build plate.

A process for producing a piezoelectric sensor includes the following steps: a step of providing a housing made of stainless steel; a step of producing a solution of a compound comprising a metal or metalloid element; a step of depositing a layer of the solution over at least one inner surface of the housing; a step of oxidizing the deposited layer of solution; a step of placing a piezoelectric element inside the housing; a step of closing the housing. A piezoelectric sensor obtained by means of such a process and comprising a closed steel housing, a piezoelectric element arranged inside the housing and a layer of a solution of a compound comprising a metal or metalloid element that is arranged over at least one inner surface of the housing.

A microphone device may include: a substrate wafer, a support member bonded to a front surface of the substrate wafer, a single-crystal piezoelectric film provided over the support member, a top electrode and a bottom electrode. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The top electrode may be arranged adjacent to the first surface of the single-crystal piezoelectric film. The bottom electrode may be arranged adjacent to the second surface of the single-crystal piezoelectric film. The substrate wafer may have a through-hole formed therein. The through-hole of the substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.