Patent classifications
H10N30/09
BULK-ACOUSTIC WAVE RESONATOR AND BULK-ACOUSTIC WAVE RESONATOR FABRICATION METHOD
A bulk-acoustic wave resonator includes a resonator, including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on a substrate; and an insertion layer disposed below the piezoelectric layer, and configured to partially elevate the piezoelectric layer and the second electrode, wherein the insertion layer may be formed of a material containing silicon (Si), oxygen (O), and nitrogen (N).
OSCILLATOR FREQUENCY MODULATION METHOD AND OSCILLATOR PIEZOELECTRIC STRUCTURE
An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.
Resonator devices and methods of fabricating resonator devices
According to various embodiments, there is provided a resonator device that includes a first interdigital transducer and a second interdigital transducer that is electrically connected to the first interdigital transducer. Both the first interdigital transducer and the second interdigital transducer are configured to resonate at a common frequency. At least one of an electrode width and an electrode pitch of the first interdigital transducer is different from the respective electrode width and/or electrode pitch of the second interdigital transducer such that spurious peaks of the resonator device are lower in amplitude as compared to spurious peaks of each of the first interdigital transducer and the second interdigital transducer.
Resonator devices and methods of fabricating resonator devices
According to various embodiments, there is provided a resonator device that includes a first interdigital transducer and a second interdigital transducer that is electrically connected to the first interdigital transducer. Both the first interdigital transducer and the second interdigital transducer are configured to resonate at a common frequency. At least one of an electrode width and an electrode pitch of the first interdigital transducer is different from the respective electrode width and/or electrode pitch of the second interdigital transducer such that spurious peaks of the resonator device are lower in amplitude as compared to spurious peaks of each of the first interdigital transducer and the second interdigital transducer.
Method For Producing Piezoelectric Actuator
A method for producing a piezoelectric actuator including forming a vibration plate, forming a first electrode on the vibration plate, forming a piezoelectric layer on the first electrode, and forming a second electrode on the piezoelectric layer, wherein the forming the vibration plate has a single layer forming step including forming a metal layer containing zirconium by a gas phase method, and forming a metal oxide layer by firing the metal layer, the single layer forming step is repeated, thereby forming the vibration plate in which the metal oxide layers are stacked, and the metal oxide layer has a thickness less than 200 nm.
ACOUSTIC WAVE TRANSDUCING UNIT, METHOD FOR MANUFACTURING THE SAME AND ACOUSTIC WAVE TRANSDUCER
There are provided an acoustic wave transducing unit and a method for manufacturing the same, and an acoustic wave transducer. The acoustic wave transducing unit includes: a substrate; a first electrode on the substrate; a supporting portion on a side of the first electrode away from the substrate; a diaphragm layer on a side of the supporting portion away from the substrate; a release hole penetrating through at least the diaphragm layer; the supporting portion, the diaphragm layer and the first electrode define a vibration chamber, the vibration chamber is communicated with the release hole, the supporting portion is lattice-matched with the first electrode, the supporting portion is lattice-matched with the diaphragm layer; a material of the supporting portion can be decomposed into a metal simple substance and a gas under an action of laser; Photon Energy of the supporting portion is smaller than that of the diaphragm layer.
Transducer with improved piezoelectric arrangement, mems device comprising the transducer, and methods for manufacturing the transducer
A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.
Transducer with improved piezoelectric arrangement, mems device comprising the transducer, and methods for manufacturing the transducer
A transducer includes a supporting body and a suspended structure mechanically coupled to the supporting body. The suspended structure has a first and a second surface opposite to one another along an axis, and is configured to oscillate in an oscillation direction having at least one component parallel to the axis. A first piezoelectric transducer is disposed on the first surface of the suspended structure, and a second piezoelectric transducer is disposed on the second surface of the suspended structure.
Input device and manufacturing method thereof
An input device includes a substrate structure, a conductive adhesive layer, and a piezoelectric structure. The conductive adhesive layer is disposed over the substrate structure. The conductive adhesive layer includes an adhesive portion and a plurality of metal particles, and the plurality of metal particles are substantially aligned in a first direction. The piezoelectric structure is disposed over the conductive adhesive layer. The piezoelectric structure extends in a second direction that is perpendicular to the first direction.
Vibration actuator and method for manufacturing the same
A vibration actuator includes an elastic body on which at least one projection is formed and a vibrating body including an electromechanical conversion device, and drives a driven member that is in contact with a contact portion of the projection by causing an end portion of the projection to perform an ellipsoidal movement in response to a combination of two vibration modes generated in the vibrating body when an alternating driving voltage is applied. The elastic body is formed integrally with the projection and a bonding portion between the projection and the electromechanical conversion device. A space is provided between the contact portion and the electromechanical conversion device to which the projection is bonded. The spring portion is provided between the bonding portion and the contact portion and causes the projection to exhibit a spring characteristic when the contact portion is pressed by the driven member.