A tactile sensation providing apparatus includes an actuator and an object of vibration configured to provide a tactile sensation to a user by vibration of the vibration plate being transmitted to the object of vibration. The actuator includes a piezoelectric element, a vibration plate, and supports. The vibration plate has the piezoelectric element joined thereto and vibrates in accordance with displacement of the piezoelectric element. The supports support the vibration plate. The angles, when the actuator is not being driven, between the vibration plate and the supports are acute.

An actuator includes a piezoelectric element, a vibration plate, and a holder. The vibration plate has the piezoelectric element joined thereto and vibrates an object of vibration in accordance with expansion and contraction of the piezoelectric element. The holder is joined to the vibration plate and holds the object of vibration. The height of the holder is less than the maximum bending displacement at which the piezoelectric element is not damaged by an external force.

A piezoelectric microelectromechanical structure is provided with a piezoelectric stack having a main extension in a horizontal plane and a variable section in a plane transverse to the horizontal plane. The stack is formed by a bottom-electrode region, a piezoelectric material region arranged on the bottom-electrode region, and a top-electrode region arranged on the piezoelectric material region. The piezoelectric material region has, as a result of the variable section, a first thickness along a vertical axis transverse to the horizontal plane at a first area, and a second thickness along the same vertical axis at a second area. The second thickness is smaller than the first thickness. The structure at the first and second areas can form piezoelectric detector and a piezoelectric actuator, respectively.

In one general aspect, various embodiments are directed to an ultrasonic surgical instrument that comprises a transducer configured to produce vibrations along a longitudinal axis at a predetermined frequency. In various embodiments, an ultrasonic blade extends along the longitudinal axis and is coupled to the transducer. In various embodiments, the ultrasonic blade includes a body having a proximal end and a distal end, wherein the distal end is movable relative to the longitudinal axis by the vibrations produced by the transducer.

A vibration wave actuator has a vibration member including an elastic member and an electro-mechanical energy transducer, and a contact member in contact with the vibration member, and the contact member and the vibration member move relative to each other. The vibration wave actuator includes a detected portion configured to move, together with the contact member, relative to the vibration member, and a detection unit configured to move, together with the vibration member, relative to the contact member to detect displacement information or position information for the detected portion. The vibration member has two projections provided side by side in a direction intersecting with the direction of the relative movement. The contact member contacts the two projections. The detection unit and the detected portion are located between the contact member and the vibration member when viewed from the direction of the relative movement.

A wafer holding apparatus for holding a wafer having undulation. The wafer holding apparatus includes a holding portion having a holding surface for holding the wafer, the holding portion being composed of a plurality of piezoelectric elements having suction holes selectively connected to a vacuum source, the piezoelectric elements having front end surfaces collected to form the holding surface. The wafer holding apparatus further includes a frame member supporting the holding portion and a control unit controlling a voltage to be applied to each of the piezoelectric elements according to the undulation of the wafer, whereby the wafer is held on the holding surface in the condition where the undulation of the wafer is followed by undulation produced on the holding surface due to a change in a length of each of the piezoelectric elements.

A device and a method for producing haptic feedback are disclosed. In an embodiment a device includes at least one piezoelectric actuator having a plurality of piezoelectric layers and internal electrodes arranged therebetween, a first amplification element and a second amplification element, wherein the piezoelectric actuator is arranged between the amplification elements, wherein the piezoelectric actuator is configured to change its extension in a first direction upon application of an electrical voltage, and wherein the amplification elements are configured to deform as a result of the change in the extension of the piezoelectric actuator such that a subregion of a respective amplification element is moved relative to the piezoelectric actuator in a second direction, which is perpendicular to the first direction and a driver circuit configured to apply the electrical voltage to the piezoelectric actuator such that the amplification elements are deformed thereby producing the haptic feedback against an object pressing on the device, the haptic feedback imitating a jump in force.

A device and a method for producing haptic feedback are disclosed. In an embodiment a device includes at least one piezoelectric actuator having a plurality of piezoelectric layers and internal electrodes arranged therebetween, a first amplification element and a second amplification element, wherein the piezoelectric actuator is arranged between the amplification elements, wherein the piezoelectric actuator is configured to change its extension in a first direction upon application of an electrical voltage, and wherein the amplification elements are configured to deform as a result of the change in the extension of the piezoelectric actuator such that a subregion of a respective amplification element is moved relative to the piezoelectric actuator in a second direction, which is perpendicular to the first direction and a driver circuit configured to apply the electrical voltage to the piezoelectric actuator such that the amplification elements are deformed thereby producing the haptic feedback against an object pressing on the device, the haptic feedback imitating a jump in force.

An apparatus comprises a stressed glass member and an actuator mounted on the stressed glass member. A power source is coupled to the actuator. An abrasion structure is disposed between the actuator and the stressed glass member. The abrasion structure comprises abrading features in contact with the stressed glass member. The abrading features have a hardness higher than a hardness of the stressed glass member. When energized by the power source, the actuator is configured to induce movement of the abrasion structure that causes the abrading features to create scratches in the stressed glass member to a depth sufficient to initiate fracture of the stressed glass member.

An arrangement for mechanically changing a surface includes an insulating layer, a pair of electrodes, which is arranged on or in the insulating layer, and a piezo element, which is arranged on or in the insulating layer. The piezo element is separated from the pair of electrodes by the insulating layer. The pair of electrodes is designed to generate in a region of the piezo element an electric field, which causes the piezo element to carry out a mechanical change of shape, in order in this way to mechanically change a surface of the arrangement. The pair of electrodes is also designed to generate the electric field such that the electric field has a minimum field strength in a surrounding area of the arrangement, in order in this way to generate a plasma in the surrounding area of the arrangement.