Patent classifications
H10N30/202
Driving mechanism
A driving mechanism is provided, including a fixed part, a movable part connected to the fixed part, a first connecting member, and a first wire. The first connecting member is hinged to the fixed part and connected to the movable part. The first wire has SMA material and is connected between the fixed part and the first connecting member. When the first wire contracts in length, the first connecting member rotates relative to the fixed part, and the movable part is driven to move relative to the fixed part.
LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE AND PIEZOELECTRIC ELEMENT
A liquid discharge head includes a pressure chamber substrate provided with a plurality of pressure chambers, a vibration plate, a first electrode, a first thin film piezoelectric body, a second thin film piezoelectric body, and a second electrode, which are laminated in this order along a lamination direction, in which a content of lead contained in the liquid discharge head is 0.1% by weight or less, no other member is interposed between the first thin film piezoelectric body and the second thin film piezoelectric body, and a Young's modulus of the second thin film piezoelectric body is higher than a Young's modulus of the first thin film piezoelectric body.
FINGERPRINT RECOGNITION MODULE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE
Embodiments of this application provide a fingerprint recognition module, a display apparatus, and an electronic device, including: a substrate, a first ultrasonic transmit signal input port and a second ultrasonic transmit signal input port that are both disposed on the substrate, and a circuit layer, a first electrode layer, a first piezoelectric layer, a second electrode layer, a second piezoelectric layer, and a third electrode layer that are sequentially disposed on a same side of the substrate. The circuit layer includes a plurality of circuit units, the first electrode layer includes a plurality of electrode blocks spaced from each other, and the plurality of circuit units are correspondingly coupled to the plurality of electrode blocks.
CRYSTAL OSCILLATION CHIP
A crystal oscillation chip including a casing and a crystal oscillation piece is provided. The crystal oscillation piece is disposed in the casing. The crystal oscillation piece includes a flat substrate, two electrodes and two conductive silver glues, the two electrodes are respectively disposed on two opposite main surfaces of the flat substrate. The flat substrate includes at least one notch. The notch is disposed at a side surface of the flat substrate and is recessed along a direction vertical from the side surface and toward an interior of the flat substrate. A height of the notch is the same as a thickness of the flat substrate, and two conductive silver glues connect the flat substrate and the casing.