A sensor device that senses proper acceleration. The sensor device includes a substrate, a spacer layer supported over a first surface of the substrate, at least a first cantilever beam element having a base and a tip, the base attached to the spacer layer, and which is supported over and spaced from the substrate by the spacer layer. The at least first cantilever beam element further including at least a first layer comprised of a piezoelectric material, a pair of electrically conductive layers disposed on opposing surfaces of the first layer, and a mass supported at the tip portion of the at least first cantilever beam element.

The following relates generally to optical voltage sensing, and in particular to optical voltage sensing of power grids and of a subject body. For example, some embodiments include an optical resonator comprising: (i) a top electrode layer, (ii) a piezoelectric layer, and (iii) a substrate. A light source may illuminate the optical resonator of the voltage sensor with light comprising an incident optical power at an input wavelength, where the input wavelength is offset from a resonant wavelength of the optical resonator by a baseline voltage. The applied voltage may then be measured by measuring a reflected or transmitted light power.

According to one embodiment, a cantilever array includes a plurality of cantilever pairs. Each of the cantilever pairs includes a first cantilever and a second cantilever facing the first cantilever while having a gap, and which are arrayed in a direction orthogonal to a facing direction. Positions of the gaps of the cantilever pairs shift from each other when viewing in an array direction.

A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.

A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.

A polymer composite exhibiting piezoelectric properties can be formed for flexible and/or thin film applications, in which the polymer composite includes a polymer matrix and a piezoelectric ceramic filler embedded in the polymer matrix. The polymer matrix may include at least two polymers: a first polymer and a second polymer. The first polymer may be a fluorinated polymer, and the second polymer may be compatible with the first polymer and have a dielectric constant of less than approximately 20. The piezoelectric ceramic filler can be lithium doped potassium sodium niobite (KNLN), and be approximately 40-70% by volume of the polymer composite. The remaining 30-60% by volume may be the polymer matrix, which may itself be approximately 5-20% by weight second polymer and 80-95% fluorinated polymer.

A piezoelectric coaxial sensor includes: a sensor portion including a center conductor having a linear shape, a polymer piezoelectric layer containing polyvinylidene fluoride and that covers an outer peripheral surface of the center conductor, and a first outer conductor that surrounds an outer peripheral surface of the polymer piezoelectric layer; and jacket layers that each include a film having a tape shape wound to surround an outer peripheral surface of the sensor portion. The film of at least one of the jacket layers exposed to the outside of the piezoelectric coaxial sensor among the other jacket layers is adhered to a member in contact with an adhesive layer by the adhesive layer. The adhesive layer includes a thermoplastic resin having a melting point of 120° C. or lower.

The present invention relates to a pressure signal detection circuit and a pressure signal detection method in which a pyroelectric signal from a piezoelectric film is suppressed. More specifically, the pressure signal detection circuit receives input of an input signal from a piezoelectric film, differentiates the input signal for signal component analysis of the input signal, outputs the signal analysis value of the input signal based on the differential value, removes offset of the input signal by using the signal component analysis value, integrates the input signal, and outputs a pressure input signal value from which a heat input signal value is removed.

A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.

An ultrasonic device includes: a vibration film provided with a vibration region that is vibratable by a vibration element; and a damper layer that is provided to cover the vibration region of the vibration film. The damper layer has a thickness dimension of 13 μm or larger and 25 μm or smaller.