A grip detection sensor that includes: a piezoelectric film having a first main surface and a second main surface, either one of the first main surface and the second main surface being disposed at least partly on a periphery of a linearly shaped flexible object, a first electrode on the first main surface, a second electrode on the second main surface, and a spacer configured to maintain a space between the object and the piezoelectric film.

An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided at a position of the support film which overlaps the first opening when viewed in a thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided at a position of the support film which overlaps the second opening when viewed in the thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is larger than a thickness dimension of the receiving piezoelectric film.

A sensor system that combines the sensing application of surface acoustic wave (SAW) sensor and sensor signal transfer though the enclosure wall via acoustic means. The sensor system includes SAW sensor placed inside the enclosure and at least one pair of bulk acoustic wave (BAW) transducers, one mounted inside and second outside the enclosure wall, allowing the interrogation of SAW sensor from outside the enclosure. The external BAW transducer converts interrogation electrical pulse into acoustic pulse which travels though the enclosure wall to the internal BAW transducer. The internal BAW transducer converts the interrogation electrical pulse to electrical pulse and transfers it to SAW sensor. The response of the SAW transducer containing series of electric pulses is converted to the series of acoustic pulses by internal BAW transducer which propagates though enclosure wall. The external BAW transducer converts the series of acoustic pulses into series of electrical pulses and is received by the interrogation circuit for processing.

In a reservoir element that has a plurality of vibrators, at least one of the plurality of vibrators has a vibration state that is different from the vibration states of the other vibrators. The vibrations of the plurality of vibrators are configured to affect each other.

A piezoelectric sensor and a manufacturing method therefor, and a detection apparatus, which relate to the technical field of sensing. The piezoelectric sensor includes: an array substrate: a first capping layer located on the array substrate and including a first portion and a second portion, wherein the first portion covers the array substrate, a cavity is provided between the second portion and the array substrate, and the second portion is provided with a first opening: a first electrode located above the first capping layer and above the cavity, a piezoelectric thin film located on the first electrode, and a second electrode located on the piezoelectric thin film.

A metal substrate supported by a wiring substrate includes a first extending portion and a first connection portion connected to the first extending portion. The first connection portion includes a first region facing a portion of a wiring substrate in a Z-axis direction, a second region being continuous from the first region, and a third region being continuous from the second region. When viewed in the Z-axis direction, in a direction perpendicular to a connection direction in which the third region is connected to the second region, a width of the second region is larger than a width of the third region. A first bonding member bonding the wiring substrate and the metal substrate includes a first portion disposed between the portion and the first region, and a second portion being continuous from the first portion. The second portion reaches the second region but does not reach the third region.

An actuator device includes a wiring substrate; a metal substrate; a first electrode unit provided to the metal substrate; a piezoelectric drive body disposed on the first electrode unit; a second electrode unit disposed on a first main surface of the piezoelectric drive body; a piezoelectric detection body disposed on the second electrode unit; a third electrode unit disposed on a third main surface of the piezoelectric detection body; a connection unit; an input unit; and an output unit. The connection unit is configured to be electrically connected to a reference potential on an outside such that a potential of the second electrode unit becomes the reference potential. The input unit is configured to input a drive signal to the first electrode unit from the outside. The output unit is configured to output an output signal generated in the piezoelectric detection body, to the outside from the third electrode unit.

A metal substrate supported by a wiring substrate includes a movable portion, a first extending portion, a first coupling portion that couples the first extending portion and the movable portion, and a first connection portion connected to the first extending portion. The first connection portion includes a first fixing region fixed to the wiring substrate, and a first connection region connected to the first extending portion and to the first fixing region. The first connection region includes a first bent portion. The first bent portion has a first outer edge on a movable portion side, and a second outer edge opposite the movable portion, and each of the first outer edge and the second outer edge is bent toward the movable portion side when viewed in a Z-axis direction.

In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.

A force-measuring device (FMD) assembly for a portable electronic apparatus includes a mid-frame including a base portion, a sidewall portion, and a transition region between the base portion and the sidewall portion, and force-measuring devices coupled to the inner surface of the sidewall portion. The sidewall portion and the transition region are elongate along a longitudinal axis. FMDs are coupled to the inner surface at respective contact regions of the sidewall portion and are separated from each other along the longitudinal axis. Each of the FMDs includes strain-sensing element(s). Each of the FMDs corresponds to a respective sense region of the sidewall portion. The transition region includes a respective elongate slit or trough for each of the sense regions. The respective elongate slit or trough is elongate along the longitudinal axis. Adjacent elongate slits or troughs are separated by a respective rib.