The present application relates to a method for producing ceramic multi-layer components (100), comprising the following steps: providing green layers (5) for the ceramic multi-layer components (100), stacking the green layers (5) into a stack and subsequently pressing the stack into a block (1), singulating the block (1) into partial blocks (3) each having a longitudinal direction (X), thermally treating the partial blocks (3) and subsequently machining surfaces of the partial blocks (3), wherein recesses (11) are produced on the surfaces of the partial blocks (3) during the machining, and singulating the partial blocks (3). The application further relates to a multi-layer component.

The present invention relates to a component (1) for generating active haptic feedback, comprising a main body (2) having first and second internal electrodes (3, 4) stacked one above another in a stacking direction (S), wherein a respective piezoelectric layer (9) is arranged between the internal electrodes (3, 4), wherein the component (1) is configured to identify a force exerted on the component (1), wherein the component (1) is configured to generate active haptic feedback if a force exerted on the component (1) is identified, and wherein the haptic feedback is generated by virtue of an electrical voltage being applied between the first and second internal electrodes (3, 4), said electrical voltage resulting in a change in length of the main body (2).

Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

A piezoelectric element includes a stack including a plurality of internal electrodes and a plurality of piezoelectric layers stacked on one another, and a surface electrode located on a side surface of the stack and electrically connected to the plurality of internal electrodes. The stack includes the piezoelectric layers being stacked and the internal electrodes each between adjacent piezoelectric layers. The internal electrodes include a first electrode that applies a voltage to the piezoelectric layers to cause the stack to bend in a first direction (X-direction) orthogonal to a longitudinal direction (Z-direction) of the stack, and a second electrode that applies a voltage to the piezoelectric layers to cause the stack to bend in a second direction (Y-direction) orthogonal to the longitudinal direction and to the first direction. The stack includes a groove extending in the longitudinal direction on an upper surface of the stack.

A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region having a first compliance, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a second compliance, the first and second compliances being different. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.

A piezoelectric microelectromechanical systems microphone is provided comprising a sensor, an anchor region at which the sensor is supported by a substrate, a first region of the sensor adjacent to the anchor region, the first region having at least one piezoelectric layer and at least one electrode, and a second region of the sensor, the second region being adjacent to the first region, having at least one piezoelectric layer and at least one electrode, and having a thickness less than the thickness of the first region. A method for manufacturing a piezoelectric microelectromechanical systems microphone is also provided.

Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

A piezoelectric actuator includes: a vibration plate: a first piezoelectric body arranged on one side in a thickness direction of the vibration plate; a second piezoelectric body arranged on a side, of the first piezoelectric body, opposite to the vibration plate in the thickness direction; a first electrode arranged between the vibration plate and the first piezoelectric body; a second electrode arranged between the first and second piezoelectric bodies in the thickness direction, and overlapping with the first electrode in the thickness direction; and a third electrode arranged on a side, of the second piezoelectric body, opposite to the first piezoelectric body in the thickness direction, and overlapping with the second electrode in the thickness direction. The second piezoelectric body covers at least a part of a first end surface, of the first piezoelectric body, which is an end surface in a first direction orthogonal to the thickness direction.

An audio device includes a vibration member, and a first piezoelectric vibrator and a second piezoelectric vibrator that are provided on the vibration member. A natural frequency of the first piezoelectric vibrator is larger than a natural frequency of the second piezoelectric vibrator.

A piezoelectric assembly, a screen component, and a mobile terminal are provided. The piezoelectric assembly can include a vibrating member made of a piezoelectric material and a signal line connected to the vibrating member. The vibrating member includes two or more piezoelectric elements stacked in sequence. A size of at least one of the piezoelectric elements is smaller than a size of any remaining one of the piezoelectric elements to form a stepped structure. Each of the piezoelectric elements is provided with two or more piezoelectric layers of the same size.