Patent classifications
H10N30/508
Piezoelectric element and vibrating device
A piezoelectric element includes a piezoelectric body, an electrode layer, and a reinforcing layer. The piezoelectric body has a first main surface, a second main surface, and a side surface. The first main surface and the second main surface oppose each other. The side surface extends in an opposing direction in which the first main surface and the second main surface oppose each other in such a way as to connect the first main surface and the second main surface. The electrode layer is provided in the piezoelectric body. The reinforcing layer is provided on the first main surface. The electrode layer is provided opposing the first main surface and apart from the side surface. When viewed from the opposing direction, the electrode layer has a corner. When viewed from the opposing direction, the reinforcing layer overlaps the corner.
TRANSDUCER AND METHOD OF PRODUCING TRANSDUCER
[Object] To provide a transducer capable of providing a high degree of freedom in deformation and suppressing a risk of breakage and a method of producing the transducer. [Solving Means] In order to achieve the above-described object, a transducer according to an embodiment of the present technology includes an elastomer. The elastomer extends along a predetermined axis direction, and has both end portions in which at least two electrodes having followability are disposed on both sides around a predetermined axis in the predetermined axis direction, the both end portions being elongated to be folded in a direction perpendicular to the predetermined axis. This makes it possible to provide a high degree of freedom in deformation and to suppress a risk of breakage.
PIEZOELECTRIC ELEMENT AND VIBRATING DEVICE
A piezoelectric element includes a piezoelectric body, an electrode layer, and a reinforcing layer. The piezoelectric body has a first main surface, a second main surface, and a side surface. The first main surface and the second main surface oppose each other. The side surface extends in an opposing direction in which the first main surface and the second main surface oppose each other in such a way as to connect the first main surface and the second main surface. The electrode layer is provided in the piezoelectric body. The reinforcing layer is provided on the first main surface. The electrode layer is provided opposing the first main surface and apart from the side surface. When viewed from the opposing direction, the electrode layer has a corner. When viewed from the opposing direction, the reinforcing layer overlaps the corner.
HYBRID STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME
A hybrid structure and a method for manufacturing a hybrid structure comprising an effective layer of piezoelectric material having an effective thickness and disposed on a supporting substrate having a substrate thickness and a thermal expansion coefficient lower than that of the effective layer includes: a) a step of providing a bonded structure comprising a piezoelectric material donor substrate and the supporting substrate, b) a first step of thinning the donor substrate to form a thinned layer having an intermediate thickness and disposed on the supporting substrate, the assembly forming a thinned structure; c) a step of heat treating the thinned structure at an annealing temperature; and d) a second step, after step c), of thinning the thinned layer to form the effective layer. The method also comprises, prior to step b), a step a) of determining a range of intermediate thicknesses that prevent the thinned structure from being damaged during step c).
PIEZOELECTRIC ELEMENT AND LIQUID EJECTION HEAD
A piezoelectric element includes a first electrode disposed over a substrate, an orientation control layer disposed over the first electrode and containing titanium, a piezoelectric layer disposed over the orientation control layer and having a perovskite crystal structure, and a second electrode disposed over the piezoelectric layer. The orientation control layer has a thickness in the range of 5.0 nm to 22.0 nm.
Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.
Method for producing a piezoelectric multilayer component, piezoelectric multilayer component containing an auxiliary material, and use of an auxiliary material for setting the breaking stress of a piezoelectric multilayer component
Provision is made of a method for producing a piezoelectric multilayer component (1), in which piezoelectric green sheets, at least one ply (21) containing an auxiliary material having a first and a second component and layers (20) containing electrode material are arranged one above another alternately and sintered, wherein, during the sintering, the first and second components of the auxiliary material chemically react, and the at least one ply (21) containing the auxiliary material is degraded. In addition, provision is made of a piezoelectric multilayer component (1) comprising a plurality of alternating layers of electrode material (20) and piezoelectric ceramic and at least one layer (21) of auxiliary material having a breaking load which is reduced compared to the other layers of electrode material, wherein, in addition to the first and second components, the auxiliary material comprises a fifth component, which, at the preferred sintering temperatures for the piezoelectric material, in particular at most 1050 C., at most has a negligible sintering activity and does not react with the piezoelectric material used. Finally, the use of ZrO.sub.2, BaTiO.sub.3 or a mixture thereof in the auxiliary material layer of a piezoelectric multilayer component for reducing the breaking stress is described.
Method for producing a multi-layer component and multi-layer component
A method for producing a multilayer component (21) is specified, which involves providing a body having dielectric layers (3) arranged one above another and first and second electrically conductive layers (4, 84, 5, 85) arranged therebetween. The first conductive layers (4, 84) are connected to a first auxiliary electrode (6) and the second conductive layers (5, 85) are connected to a second auxiliary electrode (7). The body (1, 81) is introduced into a medium and a voltage is applied between the first and second auxiliary electrodes (6, 7) for producing a material removal. Furthermore, a multilayer component is specified, which has depressions (20) formed by an electrochemically controlled material removal.
LAMINATED PIEZOELECTRIC ELEMENT AND ELECTROACOUSTIC TRANSDUCER
An object of the present invention is to provide a laminated piezoelectric element obtained by folding and laminating a piezoelectric film, in which, in a case where a pressure is applied, it is possible to prevent an electrode layer from breaking at a folded-back portion, and to provide an electroacoustic transducer using the laminated piezoelectric element. The object is achieved by including a bonding layer for bonding adjacent layers to each other in the lamination of the piezoelectric film, in which, in a case where a thickness of the bonding layer at a center portion in a folding-back direction of the piezoelectric film is denoted as d1 and a spacing between piezoelectric films at a folded-back portion of the piezoelectric film in a lamination direction is denoted as d2, a relationship of d2<d1 is satisfied.
FILM STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A film structure (10) includes a substrate (11), a piezoelectric film (14) formed on the substrate (11) and containing first composite oxide represented by a composition formula Pb(Zr.sub.1?xTi.sub.x)O.sub.3, and a piezoelectric film (15) formed on the piezoelectric film (14) and containing second composite oxide represented by a composition formula Pb(Zr.sub.1?yTi.sub.y)O.sub.3. In the composition formulae, x satisfies 0.10<x?0.20, and y satisfies 0.35?y?0.55. The piezoelectric film (14) has tensile stress, and the piezoelectric film (15) has compressive stress.