According to an embodiment, a microelectromechanical systems MEMS device includes a first membrane attached to a support structure that a first plurality of acoustic vents; a second membrane attached to the support structure that includes a second plurality of acoustic vents, where the first plurality of acoustic vents and the second plurality of acoustic vents do not overlap; and a closing mechanism coupled to the first membrane and the second membrane.

Disclosed herein is an apparatus and method for fine tuning properties of a thin film. The method of forming a piezoelectric film includes (a) depositing a first piezoelectric film layer on a surface of a substrate by a first physical vapor deposition (PVD) process. The method includes (b) depositing a second piezoelectric film layer, on top of and in contact with the first piezoelectric film layer, by a second PVD process. A temperature of the substrate is (c) reduced after forming the first piezoelectric film layer and before forming the second piezoelectric film layer. The temperature is reduced by performing a process for a first period of time. Processes (a), (b) and (c) are additionally performed one or more times. Process (c) is performed for a second period of time. The second period of time is different than the first period of time.

A composite substrate of the present disclosure is a composite substrate comprising a piezoelectric substrate and a sapphire substrate which are directly bonded, wherein the ratio of the number of oxygen atoms to the number of aluminum atoms in the bonding surface region including the bonding surface of the sapphire substrate bonded to the piezoelectric substrate is less than 1.5. The piezoelectric device of the present disclosure comprises the composite substrate. A method for manufacturing the composite substrate of the present disclosure comprises a step of preparing a piezoelectric substrate and a sapphire substrate, a step of heat-treating the sapphire substrate in a reducing atmosphere or in a vacuum, and a step of directly bonding the piezoelectric substrate to the sapphire substrate.

A light, flexible, and tough thin film having high total light transmittance that can be formed on various three dimensional shapes, and also provides a stably driven tactile sensor, which is an electronic device having the switching function thereof, is provided. The tactile sensor is formed on a polyimide thin film having high total light transmittance, thermal resistance, and a polar component of surface free energy with a specific value, and has a switching device that emits a voltage signal which, through an electronic circuit for controlling noise, stably drives another device. This tactile sensor has a curved or flat surface and has a first electrode, a ferroelectric layer, and a second electrode formed over the polyimide thin film. The switching device as a tactile sensor can drive another device merely by a light touch with a finger, and can be manufactured at a high non-defective rate.

A buzzer unit 4 includes a case 10, a vibrating element 11, and a pressing member 14. The case 10 includes a vibrating plate 28 in which no through-holes are formed. The case 10 includes a storage space 22 formed therein on the lower side X2 of the vibrating plate 28. The vibrating element 11 faces the vibrating plate 28 in the vertical direction X inside the storage space 22, produces vibration as a result of voltage being applied thereto, and as a result, causes the vibrating plate 28 to vibrate. The pressing member 14 is stored in the storage space 22, and presses the vibrating element 11 against the vibrating plate 28.

A curved electrode structure includes a piezoelectric material layer, a first conductive layer, a first protection layer and a second conductive layer. The piezoelectric material layer is disposed between the first conductive layer and the second conductive layer. The first conductive layer is disposed on the piezoelectric layer. Each of the first conductive layer and the piezoelectric material layer has a first contact surface. The two first contact surfaces are both circular shaped. The first protection layer is disposed on the conductive layer. Each of the first protection layer and the first conductive layer has a second contact surface. The two second contact surfaces are both circular shaped.

An electrical circuit assembly can include a semiconductor integrated circuit, such as fabricated including CMOS devices. A first lateral-mode resonator can be fabricated upon a surface of the semiconductor integrated circuit, such as including a deposited acoustic energy storage layer including a semiconductor material, a deposited piezoelectric layer acoustically coupled to the deposited acoustic energy storage layer, and a first conductive region electrically coupled to the deposited piezoelectric layer and electrically coupled to the semiconductor integrated circuit. The semiconductor integrated circuit can include one or more transistor structures, such as fabricated prior to fabrication of the lateral-mode resonator. Fabrication of the lateral-mode resonator can include low-temperature processing specified to avoid disrupting operational characteristics of the transistor structures.

A strain sensor unit and a skin sensor module comprising the same are provided. The strain sensor unit according to an embodiment of the present disclosure includes a substrate having a through-hole, and including a first electrode and a second electrode formed at one side and the other side of the through-hole on one surface of the substrate, a piezoelectric device drawn from the first electrode and extending inward the through-hole, and a piezoresistor drawn from the second electrode and extending inward the through-hole, wherein the piezoresistor overlaps with a whole or part of the piezoelectric device.

An inkjet printing head 1 includes an actuator substrate 2 having pressure chambers (cavities) 7, a movable film formation layer 10 including movable films 10A disposed above the pressure chambers 7 and defining top surface portions of the pressure chambers 7, and piezoelectric elements 9 formed above the movable films 10A. Each piezoelectric element 9 includes a lower electrode 11 formed above a movable film 10A, a piezoelectric film 12 formed above the lower electrode 11, and an upper electrode 13 formed above the piezoelectric film 12. The piezoelectric film 12 includes an active portion 12A with an upper surface in contact with a lower surface of an upper electrode 13 and an inactive portion 12B led out in a direction along a front surface of the movable film formation layer 10 from an entire periphery of a side portion of the active portion 12A and having a thickness thinner than that of the active portion 12A.

A composite substrate has a first substrate having a surface; a second substrate having a first surface and a second surface opposite to the first surface in a thickness direction and facing the surface of the first substrate with a gap therebetween, the second substrate extending in a longitudinal direction perpendicular to the thickness direction, the second substrate having first and second ends in the longitudinal direction, and a driver circuit being provided on the first surface; a flexible print circuit board has a portion bonded a position on the first substrate between the first end and the driver circuit, the bonding region being defined on the first surface, and a support member positioned between the surface of the first substrate and the second surface of the second substrate, the support member overlapping all of the bonding region, as viewed in the thickness direction.