A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.

Technologies for a microelectromechanical system (MEMS) made up of composable piezoelectric actuators is disclosed. An elongated piezoelectric rod is disposed between a top and a bottom electrode. The top electrode runs along one edge of the top of the piezoelectric rod for a first segment, then runs along the other edge of the top of the piezoelectric rod for the a second segment. When a voltage is applied across the electrodes, the piezoelectric rod bends in a first direction for the first segment and in a second direction opposite the first for the second segment, displacing the tip of the rod. Several such rods can be joined in parallel and/or series, allowing for large-scale systems to be composed.

A method of forming a microphone device includes: forming a through-hole in a substrate wafer; providing a second wafer; bonding the second wafer to the substrate wafer; and forming a top electrode over a first surface of a single-crystal piezoelectric film of the second wafer. The second wafer may include the single-crystal piezoelectric film. The single-crystal piezoelectric film may have a first surface and an opposing second surface. The second wafer may further include a bottom electrode arranged adjacent to the second surface, and a support member over the single-crystal piezoelectric film. The through-hole in substrate wafer may be at least substantially aligned with at least one of the top electrode and the bottom electrode.

The disclosure provides an electricity generating insert for a piece of footwear, the insert can be removably placed in the heel portion, e.g. under the insole. The insert comprises a multilayer piezoelectric stack that alternatively flexes under the compression-decompression that occurs during locomotion, which flexing causes friction in the stack to generate electricity capable of charging electronic devices and the like, e.g. via a port on the footwear.

A piezoelectric device includes a piezoelectric body at least a portion of which can bend and vibrate, an upper electrode on an upper surface of the piezoelectric body and in which distortion of a crystal lattice is reduced as a distance from the upper surface of the piezoelectric body increases, a lower electrode on a lower surface of the piezoelectric body and in which distortion of a crystal lattice is reduced as a distance from the upper surface of the piezoelectric body increases, and a support substrate below the piezoelectric body, in which a recess extending from a lower surface of the support substrate toward the lower surface of the piezoelectric device is provided.

Provided is a vibration panel including an inner member, a first outer member, a second outer member, a piezoelectric actuator, an actuator bonding layer, and a filler. The inner member includes first and second main surfaces. The first outer member includes third and fourth main surfaces, the third main surface including a first region and a second region. The second outer member includes fifth and sixth main surfaces, the fifth main surface including a third region and a fourth region. The piezoelectric actuator causes vibration. The actuator bonding layer is disposed between the piezoelectric actuator and the second region and bonds the piezoelectric actuator to the second region. The filler fills a space between the second region and the fourth region and covers the piezoelectric actuator.

An acoustic wave device includes a support substrate, a piezoelectric body layer, an interdigital transducer electrode, and an external connection electrode. The piezoelectric body layer is on the support substrate. The interdigital transducer electrode is on the piezoelectric body layer. The external connection electrode is electrically connected to the interdigital transducer electrode. The external connection electrode does not overlap the piezoelectric body layer in a plan view from a thickness direction of the support substrate. The support substrate includes a hollow portion. The hollow portion is at least on an end portion of the support substrate in a plan view from the thickness direction.

A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a high emissivity layer that is disposed at a surface of the heat generating unit on a first lid side and that has an emissivity higher than an emissivity of the surface. In addition, a constituent material of the surface is silicon, and the emissivity of the high emissivity layer at room temperature is 0.5 or more.

A vibrating actuator includes a contact body and a vibrating body that vibrates, has an energy conversion element, and has an elastic body in contact with the contact body to move relative to each other from the vibration. The contact body has a base part, a thin plate part, a support part, and a friction member. The thin plate part extends from the base part toward an annular center axis of the base part and the support part is disposed at an end of the thin plate part. The friction member is disposed to the support part as a member separate from the support part and in contact with the elastic body. Density of the friction member is higher than density of the thin plate part. A weight ratio of the thin plate part to a total weight of the friction member and the support part is 0.5 to 1.5.

An electromagnetic-piezoelectric composite vibration control device based on a synchronized switch damping technology is provided. An upper guiding component is installed inside the upper rigid frame, a lower guiding component is installed inside a lower rigid component, a guide rod is nested inside the upper guiding component and the lower guiding component, an upper idler wheel mechanism and a lower idler wheel mechanism are fixedly sleeved on the guide rod and are positioned between the upper guiding component and the lower guiding component respectively, an electromagnetic mechanism is fixedly sleeved outside the guide rod, one end of each piezoelectric cantilever beam is fixed between the upper rigid frame and the lower rigid frame, the other end is arranged between the upper idler wheel mechanism and the lower idler wheel mechanism, and the piezoelectric cantilever beams and the electromagnetic mechanism are connected with a circuit system respectively.