A superconducting magnet includes a superconducting coil, a coolant container, a radiation shield, a first pipe, a second pipe, a refrigerator, and a connection pipe. The refrigerator is fixed to seal a tip end of the second pipe, and is inserted in the second pipe to define a flow path of a coolant between the refrigerator and the second pipe. The connection pipe makes the interiors of the first pipe and the second pipe communicate with each other inside a vacuum container. The connection pipe includes a first connection portion connecting to the first pipe and a second connection portion connecting to the second pipe. The second connection portion is located between the vacuum container and the radiation shield.

A superconducting magnet includes a superconducting coil, a coolant container, a radiation shield, a vacuum container, a first pipe, a refrigerator, a separator, a second pipe, a third pipe, a fourth pipe, and at least one pressure relief valve. The refrigerator is disposed such that a first flow path of vaporized coolant is defined by the refrigerator and the first pipe. The third pipe is connected to the first pipe outside the vacuum container, and extends in contact with the vacuum container. The fourth pipe is connected to the second pipe outside the vacuum container, and extends in contact with the vacuum container. The pressure relief valve is connected to the third pipe and the fourth pipe.

A superconducting electrical device includes one or more traveling-wave parametric amplifiers (TWPAs) on a chip that is electrically connected to a wiring layer of a substrate. The electrical connection of the chip to the wiring layer of the substrate includes, for each of the one or more TWPAs, a signal bump-bond between the TWPA and the substrate. There is a peripheral ring of ground bumps around the signal bump between the TWPA and the substrate.

Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.

A cryogenic device includes: a hermetic container; a cryocooler including a mounting portion mounted on the container, a connecting part extending from the mounting portion into the container in an axial direction of the cryocooler, and a cooling stage attached to the connecting part and disposed in the container; and a member to be cooled that is disposed in the container with a gap, which is configured to allow heat to be exchanged, between the cooling stage and the member. The cooling stage includes a cold fin extending in a direction perpendicular to the axial direction. A fin receiving groove recessed in the direction perpendicular to the axial direction is formed in the member to be cooled and extends in the axial direction, and the member to be cooled receives the cold fin in the fin receiving groove with the gap.

An electronic structure includes a first substrate having a first under bump metallization (UBM) region and a second UBM region formed thereon. One or more solder bumps is deposited onto the first UBM region. A downstop formed on the second UBM region is wider, shallower and more rigid than any one of the solder bumps formed on the first UBM region. A second substrate is joined to the first substrate by the one or more solder bumps located on the first UBM region, and a height of the downstop limits a distance between at least one of the first substrate and the second substrate, or between an object and at least one of the first substrate and the second substrate.

An electronic structure includes a first substrate having a first under bump metallization (UBM) region and a second UBM region formed thereon. One or more solder bumps is deposited onto the first UBM region. A downstop formed on the second UBM region is wider, shallower and more rigid than any one of the solder bumps formed on the first UBM region. A second substrate is joined to the first substrate by the one or more solder bumps located on the first UBM region, and a height of the downstop limits a distance between at least one of the first substrate and the second substrate, or between an object and at least one of the first substrate and the second substrate.

A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.

A cryogenic electronics device includes a semiconductor chip. A substrate is flip-chip bonded to the semiconductor chip. A plurality of bump bonds are concentrated in a bump region of the semiconductor chip. A plurality of circuit elements are arranged in a predefined region of the semiconductor chip. The predefined region and the bump region are separate regions.

Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.