A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.

Various fabrication method are disclosed. In one such method, at least one structure is formed on a substrate which protrudes outwardly from a plane of the substrate. A beam is used to form a layer of material, at least part of which is in direct contact with a semiconductor structure on the substrate, the semiconductor structure comprising at least one nanowire. The beam has a non-zero angle of incidence relative to the normal of the plane of the substrate such that the beam is incident on one side of the protruding structure, thereby preventing a portion of the nanowire in a shadow region adjacent the other side of the protruding structure in the plane of the substrate from being covered with the material.

A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.

A quantum circuit device includes a qubit chip including a plurality of qubits and a plurality of flux tunable couplers. A plurality of fixed frequency qubits are arranged in in a lattice structure, wherein each pair of the plurality of fixed frequency qubits is coupled to one flux tunable coupler. A wiring layer is coupled to the qubit chip, and the wiring layer includes a loop constructed of a superconducting material that is inductively coupled to the flux tunable couplers. A flux bias line is constructed of a superconducting material that is different than the superconducting material of the loop, wherein the flux bias line is inductively coupled to both the loop and the flux tunable couplers.

A quantum circuit device includes a qubit chip including a plurality of qubits and a plurality of flux tunable couplers. A plurality of fixed frequency qubits are arranged in in a lattice structure, wherein each pair of the plurality of fixed frequency qubits is coupled to one flux tunable coupler. A wiring layer is coupled to the qubit chip, and the wiring layer includes a loop constructed of a superconducting material that is inductively coupled to the flux tunable couplers. A flux bias line is constructed of a superconducting material that is different than the superconducting material of the loop, wherein the flux bias line is inductively coupled to both the loop and the flux tunable couplers.

A carrier is provided for quantum computer chips that allows easy implementation, connection, and communication to and from the quantum computer chips while minimizing the thermal perturbation and avoiding labor intensive manual connection as well as the human error in such manual connection. Methods for fabricating such carriers are also provided.

A carrier is provided for quantum computer chips that allows easy implementation, connection, and communication to and from the quantum computer chips while minimizing the thermal perturbation and avoiding labor intensive manual connection as well as the human error in such manual connection. Methods for fabricating such carriers are also provided.

A quantum device, a manufacturing method thereof, and an electronic device are provided. The quantum device includes: a quantum chip, wherein a signal transmission element and a connecting segment electrically connected to the signal transmission element are formed on the quantum chip; a package substrate, wherein a lead-out segment and a lead-out signal line configured to be electrically connected to a signal connector are formed on the package substrate, and the lead-out signal line is electrically connected to the lead-out segment; and a ball grid array configured to electrically connect the connecting segment to the lead-out segment corresponding to each other. The ball grid array electrically connects the connecting segment to the lead-out segment whose signal transmission properties correspond to each other, thereby realizing electrically connecting the quantum chip to the transmission line, and leading out the connecting segment to an external signal connector.

A quantum device, a manufacturing method thereof, and an electronic device are provided. The quantum device includes: a quantum chip, wherein a signal transmission element and a connecting segment electrically connected to the signal transmission element are formed on the quantum chip; a package substrate, wherein a lead-out segment and a lead-out signal line configured to be electrically connected to a signal connector are formed on the package substrate, and the lead-out signal line is electrically connected to the lead-out segment; and a ball grid array configured to electrically connect the connecting segment to the lead-out segment corresponding to each other. The ball grid array electrically connects the connecting segment to the lead-out segment whose signal transmission properties correspond to each other, thereby realizing electrically connecting the quantum chip to the transmission line, and leading out the connecting segment to an external signal connector.

A resonator, an oscillator, and a quantum computer capable of preventing oscillation conditions for generating a parametric oscillation from becoming complicated are provided. A resonator includes at least one loop circuit in which a first superconducting line, a first Josephson junction, a second superconducting line, and a second Josephson junction are connected in a ring shape, in which critical current values of the first and second Josephson junctions are different from each other.