This invention relates generally to a thermoplastic compositions and, more particularly, to compositions comprising a polymer matrix and comprising a filler composition. To that end, according to the aspects of the invention, a thermoplastic composition is disclosed that generally comprises a polymer matrix and at least one filler composition. The polymer matrix generally comprises at least one polycarbonate or polyamide. The filler composition generally comprises at least one laser direct structuring additive with a mean particle size of less than 1 m and may additionally optionally comprise flame retardants, stabilizers and process aids.

A composition comprises, based on the total weight of the composition, 25 wt % to 50 wt % of a polyetherimide; and 50 wt % to 75 wt % of a polyphthalamide; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

A thermoplastic composition includes a polyetherimide, a thermoplastic polyester elastomer comprising a hard segment comprising a polyester block, and a soft segment comprising a polyether block or a polyester block, and optionally, a polyester, one or more flame retardants, and one or more additives. Articles including the composition can include an extruded part, an injection molded part, or a hot-compressed part. Also described herein is an electrical wire including a conductor wire and a covering disposed over the conductor wire, wherein the covering includes the thermoplastic composition. Articles including the electrical wire are also discussed.

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.

The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

The present invention relates to electrical insulation enamels which contain a polymer comprising a base polymer and modifying units which are incompatible with the base polymer after the polymer has cured and lead to the formation of separate phases at the surface, and to processes for the production thereof. The electrical insulation enamels have a low coefficient of friction and frictional resistance and are preferably suitable for the coating of wires.

Disclosed is modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from polysilane, polycyclosilane, and a silane oligomer. The modified hydrogenated polysiloxazane has a small mole ratio of nitrogen atoms relative to silicon atoms and may remarkably deteriorate a film shrinkage ratio when included in a composition for forming a silica-based insulation layer to form a silica-based insulation layer.

A transfer material and a method of manufacturing the same, the transfer material including, in this order, a temporary support body, a first resin layer, and a second resin layer, the first resin layer not being water soluble, the second resin layer including a water soluble polymer, the second resin layer including a compound that has a heteroaromatic ring including a nitrogen atom as a ring member, and a content of the compound that has a heteroaromatic ring including a nitrogen atom as a ring member in the second resin layer being 3.0% by mass or greater with respect to a total solid content of the second resin layer. A laminated body including a substrate; an electrode pattern that is positioned above the substrate and that includes a metal in at least part of the electrode pattern; a second resin layer positioned above the electrode pattern; and a first resin layer positioned above the second resin layer, the second resin layer including a compound that has a heteroaromatic ring including a nitrogen atom as a ring member.

Various embodiments of the teachings herein include an insulation system. An example includes a polymer blend in the form of a solid two-dimensional insulation material, a material for wire insulation by means of extrusion and/or an injection-molded and/or compression-molded article. The blend is resistant to partial discharges and at least partly replaces any mica content in the insulation system. The blend comprises at least three blend partners including at least one copolymer based on polyetherimide and siloxane blended with at least two high-temperature thermoplastics. At least of one the high-temperature thermoplastics is in semicrystalline form, such that spherulites are detectable in the polymer blend.

A method for manufacturing an insulated conductive material includes providing a continuous feed of a conductive material, a first continuous feed of insulating material above a top surface of the conductive strip, and a second continuous feed of insulating material below a bottom surface of the conductive strip. Portions of the first and second continuous feeds of insulating material are compressed against a portion of the conductive material. The portions of the first and second insulating material are cured to thereby provide a continuous feed of insulated conductive material.