Patent classifications
H01B3/307
THERMOPLASTIC COMPOSITION, ELECTRICAL WIRE AND ARTICLE COMPRISING THE ELECTRICAL WIRE
A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.
Cured film-forming composition
This cured film-forming resin composition is characterized in comprising: as a component (A), a polymer containing a structural unit derived from a first monomer having the structure with formula (1); a photoacid generator as a component (B); fine particles as a component (C); and a solvent (in the formula, R.sup.1 represents hydrogen or a methyl group and R.sup.2 represents an organic group capable of undergoing elimination with the oxygen atom bonded thereto). The cured film-forming resin composition forms a cured film that has solvent resistance to organic solvents and a high liquid repellency (lyophobicity) wherein the lyophilicity/lyophobicity can be easily varied using small ultraviolet exposure doses and the lyophilic areas have a high lyophilicity even for high surface tension liquids.
Electric Insulation Material and/or Impregnation Resin for a Wrapping Tape Insulation for a Medium- and/or High-Voltage Machine
Various embodiments include an insulation material and/or impregnation resin for a wrapping tape insulation, comprising: a base resin curing to a thermoset; and a curing agent. The base resin comprises a siloxane-containing compound forming a —SiR.sub.2—O— backbone in the thermoset.
Organic dielectric materials and devices including them
Disclosed are low-temperature thermally and/or ultraviolet light curable polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such low-temperature thermally and/or ultraviolet light curable polymers. In some embodiments, the device can include a passivation layer prepared from the low-temperature thermally and/or ultraviolet light curable polymers described herein. In certain embodiments, a polymer of the disclosure has a repeating unit having the structure (I) in which Q.sup.1-Q.sup.2 and Q.sup.3-Q.sup.4 are each independently —C(H)═C(H)— or (II) in which each n is independently selected from 1, 2, 3 and 4, and the polymer includes at least one repeating unit of Formula (I) wherein Q.sup.1-Q.sup.2 and Q.sup.3-Q.sup.4 is (II).
INSULATED ELECTRICAL WIRE AND RESIN COMPOSITION
An insulated wire including a conductor (A) and an insulating layer (B) around the conductor (A). The insulating layer (B) contains an aromatic polyetherketone resin (I) and a fluorine-containing copolymer (II) and has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.40 to 0.75 kPa.Math.s. The aromatic polyetherketone resin (I) has a melt viscosity at 60 sec.sup.−1 and 390° C. of 0.30 kPa.Math.s or lower. The insulating layer (B) has a thickness of 30 to 300 μm.
Insulated conductor for use in a winding, winding derived therefrom and corresponding manufacturing methods
An insulated conductor including: at least one electrical conductor; and, an insulating coating covering said electrical conductor, having n layer(s), “n” being an integer greater than or equal to 1, the n.sup.th layer being the outermost layer having a pseudo-amorphous composition C.sub.n including at least 50% by weight of a polyaryletherketone. A process for manufacturing the insulated conductor, a heat-welding process using two sections of insulated conductor, and a coil capable of being obtained by heat-welding a winding of the insulated conductor.
Efficient and Manufacturable Mechanical Computing
Logic mechanisms operate to define the position of at least one mechanical output based on the position of two or more mechanical inputs, and employ at least one control element that functions to determine (at least in part) whether an output is moved, and which provides the same function in more than one position. Some mechanisms are configured to determine, based on the input positions, whether a path to transmit motion to an output exists or does not exist. Some mechanisms are configured to determine, based on the input positions, whether or not motion of a driven element can be accommodated without moving an output.
Process for Making Crosslinked Cable Insulation Using High Melt Strength Ethylene-Based Polymer Made in a Tubular Reactor and Optionally Modified with a Branching Agent
An insulated wire or cable is made by a process comprising the steps of: (A) extruding onto a covered or uncovered metal conductor or optical fiber a composition having a DF measured at 130° C. (60 Hz, 2 kV) or 120° C. (60 Hz, 8 kV) or 100° C. (60 Hz, 8 kV) of ≤0.5% and comprising: (1) a high melt strength ethylene-based polymer made in a tubular reactor, and (2) a peroxide, and (B) crosslinking the high melt strength ethylene-based polymer.
Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof
Provided is a polybenzoxazole having a structural unit represented by General Formula [1]. In General Formula [1], R.sup.1 is a tetravalent organic group represented by General Formula [2], and R.sup.2 is a divalent organic group. In General Formula [2], two n’s are each independently an integer of 0 to 3, in a case where a plurality of R.sup.3′s are present, the plurality of R.sup.3′s each independently represent a monovalent substituent, and *1, *2, *3, and *4 each independently represent a bonding site, in which one of *1 and *2 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1], and one of *3 and *4 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1].
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SKIN TREATMENT NEEDLE WITH ENERGY UNIFORMITY CORRUGATIONS AND SKIN TREATMENT DEVICE
Disclosed is a skin treatment needle by which energy is supplied into skin tissue to increase the speed of skin regeneration. The skin treatment needle includes a needle body that is formed of a conductive material and inserted into skin, starting from a front end thereof. A region of an outer circumferential surface of the needle body includes a conductive portion which is a region inducing an electric field different from those formed at other portions of the needle body, and the conductive portion includes a plurality of corrugations to cause an electric field formed via the conductive portion to have a uniform distribution without being biased and concentrated to a side.