Disclosed herein is a patterning formation method including printing on a film base, a manufacturing method of an electrical device using the same, and a vehicular electrical device. More particularly, disclosed herein is a patterning formation method including arranging a poly cyclohexylene dimethylene terephthalate (PCT) film as a base film or as an upper part film such as a coverlay film, and patterning a material such as a metal by a printing method or connecting printing electronic technologies on at least a part of the PCT film. Also disclosed herein is a manufacturing method of an electrical device using the same and a vehicular electrical device.

A multi-conductor cable for a vehicle includes core wires respectively having a conductor formed by a plurality of twisted wires, and an insulating layer covering an outer periphery of the conductor, and a sheath layer disposed around the core wires. A marking portion is partially formed on an outer peripheral surface of the sheath layer, and a ratio of an arithmetic average roughness Ra2 of a peripheral region adjacent to the marking portion, with respect to an arithmetic average roughness Ra1 of the marking portion, at the outer peripheral surface, is 0.10 or greater and 0.90 or less.

An insulated wire having an electrical wire structure capable of reducing a diameter while a direct-current stability property and a flame-retardant property are highly kept is provided. In the insulated wire including: a conductor; a flame-retardant semiconductive layer arranged on an outer periphery of the conductor; an insulating layer arranged on an outer periphery of the flame-retardant semiconductive layer; and a flame-retardant layer arranged on an outer periphery of the insulating layer, an oxygen index of the flame-retardant semiconductive layer defined by JIS K7201-2 is larger than 40, and a volume resistivity of the flame-retardant semiconductive layer defined by JIS C2151 is equal to or smaller than 5.010.sup.15 (cm).

A method of manufacturing a solid insulation member and an insulation member thereof are provided. The method of manufacturing the insulation member of the present invention includes manufacturing a 3D printing material using a mixed material in which one or more materials selected from among polycarbonate (PC), polybutylene terephthalate (PBT), acrylonitrile-butadiene-styrene (ABS), polyamide (PA), polyoxymethylene (POM), and polyethylene terephthalate (PET), one or more fillers selected from among TiO.sub.2, SiO.sub.2, and Al.sub.2O.sub.3, and a curing agent are mixed, and which contains different amounts of the fillers at predetermined intervals in a longitudinal direction, and sequentially stacking the manufactured 3D printing material using a 3D printer to thus manufacture a target insulation member so that the mixed material containing different amounts of the fillers at predetermined intervals in a longitudinal direction of the insulation member is sequentially stacked.

A crosslinkable low density polyethylene blend composition, cured product made therefrom, methods of making and using same, and articles containing same.

An insulated wire or cable is made by a process comprising the steps of: (A) extruding onto a covered or uncovered metal conductor or optical fiber a composition having a DF measured at 130 C. (60 Hz, 2 kV) or 120 C. (60 Hz, 8 kV) or 100 C. (60 Hz, 8 kV) of <0.5% and comprising: (1) a high melt strength ethylene-based polymer made in a tubular reactor, and (2) a peroxide, and (B) crosslinking the high melt strength ethylene-based polymer.

Disclosed are low-temperature thermally and/or ultraviolet light curable polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such low-temperature thermally and/or ultraviolet light curable polymers. In some embodiments, the device can include a passivation layer prepared from the low-temperature thermally and/or ultraviolet light curable polymers described herein. In certain embodiments, a polymer of the disclosure has a repeating unit having the structure (I) in which Q.sup.1-Q.sup.2 and Q.sup.3-Q.sup.4 are each independently C(H)C(H) or (II) in which each n is independently selected from 1, 2, 3 and 4, and the polymer includes at least one repeating unit of Formula (I) wherein Q.sup.1-Q.sup.2 and Q.sup.3-Q.sup.4 is (II).

An insulated wire has a conductor, and an insulating film including a first insulating layer covering the conductor and a second insulating layer covering the first insulating layer. The second insulating layer contains a polyimide or a polyamideimide as a main component. The first insulating layer contains a reaction product of a carboxylic acid dianhydride and a diamine as an adhesive component and a component that is the same as the main component in the second insulating layer. At least one of the carboxylic acid dianhydride and the diamine has a carbonyl group.

Disclosed herein is a styrenic block copolymer [A1-B1-C1], consisting essentially of polymer blocks A1, B1 and C1. A1 is a poly(para-alkylstyrene) block having a molecular weight from 1,000 to 60,000 g/mol. B1 is a hydrogenated polyisoprene block or a hydrogenated polybutadiene block having a molecular weight from 1,000 to 100,000 g/mol. C1 is a polystyrene block having a molecular weight from 1,000 to 100,000 g/mol; or a polymer block consisting essentially of polymerized styrene units, and hydrogenated butadiene and/or isoprene units, and having a molecular weight from 1,000 to 100,000 g/mol. Prior to hydrogenation, the block B1 has a vinyl content of 5-75 mol %; and the block C1 forms 1-80 wt % of the overall weight of the block copolymer. The selectively sulfonated forms of the copolymers are useful as high dielectric materials.

Insulated winding wires, winding wire articles, and associated formation methods are described. An insulated winding wire may include a conductor and insulation formed around the conductor. In certain embodiments, the insulation may include a first layer including a first parylene material and a second layer including a second parylene material different from the first parylene material. In other embodiments, the insulation may include one or more layers containing parylene formed over base insulation.