An inverter surge-resistant insulated wire comprising a conductor and an enamel resin-insulating laminate that has a foamed region including cells and a non-foamed region including no cells on at least one surface of the foamed region on the conductor, wherein the foamed region is configured such that a non-cell layer including no cells has cell layers formed of closed cells on both surface sides of the non-cell layer, a thickness of the non-cell layer is larger than a thickness of a partition wall among the closed cells, and 5 to 60% of a thickness of the foamed region, and at least 10 the cell layer in the foamed region is formed of a thermosetting resin; an inverter surge-resistant insulated wire having a conductor and the enamel resin-insulating laminate; and electric/electronic equipment.

An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature T.sub.B of the conductor is not more than 130 C. The restoring temperature T.sub.B is a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.

A method for producing a molding article includes preparing an insulated wire including an outermost layer disposed on an outer periphery of a conductor, the outermost layer including a resin composition including a fluorine-containing elastomer. The resin composition includes a tetrafluoroethylene-propylene copolymer and an ethylene-tetrafluoroethylene copolymer as an entire base polymer or a portion of the base polymer at a mass ratio of the tetrafluoroethylene-propylene copolymer to the ethylene-tetrafluoroethylene copolymer in a range of 100:0 to 60:40. The resin composition further includes 5 to 60 parts by mass of calcium carbonate and/or silica as an inorganic filler with respect to 100 parts by mass of the base polymer.

Provided is a layered body that has excellent partial discharge resistant properties. The layered body comprises, at least: a conductor; and an insulation film formed on the conductor. The insulation film includes, at least, a first insulation layer and a second insulation layer in this order from the conductor side. The first insulation layer is formed of a resin composition containing a metal oxide, and the second insulation layer is formed of a resin composition containing a metal oxide hydrate.

A coating composition for a substrate includes a polymer binder, one or more hydrophobic silicon dioxide compositions, and one or more UV protection agents. The polymer binder can include a fluoropolymer or an epoxy polymer resin. The coating composition can also include molybdenum disulfide.

An insulated wire, having: a single conductor or multiple conductors; an insulating layer on the outer periphery of the single conductor or each of the multiple conductors; and an adhesion layer on the outer periphery of the insulating layer, wherein the thickness of the adhesion layer is 2 to 200 m, wherein a resin constituting the adhesion layer does not have a melting point, wherein the resin constituting the adhesion layer has a tensile modulus of 0.610.sup.7 to 1010.sup.7 Pa at 250 C., and wherein a substance having 2 or more amino groups exists on the surface of the adhesion layer; a coil containing the insulated wire; and an electrical or electronic equipment using the coil.

A rectangular wire having: a multilayer conductor member constructed by stacking, in a thickness direction, a rectangular metallic conductor that has a layer of a first thermoplastic resin formed on the outer periphery thereof, the first thermoplastic resin being a non-crystalline resin having no melting point or a crystalline resin having an amide bond; and a layer of a second thermoplastic resin having a melting point of 300 C. or more on the outer periphery of the multilayer conductor member.

A rectangular wire having: a multilayer conductor member constructed by stacking, in a thickness direction, a rectangular metallic conductor that has a layer of a thermosetting resin formed on the outer periphery thereof, the thermosetting resin having a glass transition temperature of 100 C. or more and 200 C. or less and having a urethane bond; and a layer of a thermoplastic resin having a melting point of 300 C. or more on the outer periphery of the multilayer conductor member.

The present invention aims to provide a resin composition capable of providing a molded article which is excellent in flexibility, acid resistance, and electrical properties. The resin composition of the present invention includes: an aromatic polyether ketone resin (I); and a fluororesin (II), the fluororesin (II) being a copolymer of tetrafluoroethylene and a perfluoroethylenic unsaturated compound represented by the following formula (1): CF.sub.2CFRf.sup.1 (1) wherein Rf.sup.1 represents CF.sub.3 or ORf.sup.2, and Rf.sup.2 represents a C.sub.1-C.sub.5 perfluoroalkyl group, the fluororesin (II) being dispersed as particles in the aromatic polyether ketone resin (I), the resin composition satisfying a ratio (I):(II) by mass between the aromatic polyether ketone resin (I) and the fluororesin (II) of 50:50 to 10:90.

An optical stack structure includes a metal nanowire layer and an organic polymer layer. A crosslinking degree of the organic polymer layer is greater than or equal to 80% and less than or equal to 100%, and a content of volatile organic compounds in the organic polymer layer is less than or equal to 1%. The content of the volatile organic compounds in the organic polymer layer is defined as a difference between a thermal weight loss of the organic polymer layer measured at a measuring temperature and a water content of the organic polymer layer measured at the measuring temperature.