Patent classifications
H01B3/38
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure is provided and has a plate having a rear mounting surface and a front appearance surface. An aperture extends through the plate for receiving an electrical component. The plate is formed of a natural fiber thermoset composite (NFTC) having at least one fire-retardant additive.
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure is provided and has a plate having a rear mounting surface and a front appearance surface. An aperture extends through the plate for receiving an electrical component. The plate is formed of a natural fiber thermoset composite (NFTC) having at least one fire-retardant additive.
Transparent conductive film
A transparent conductive film 1 includes a transparent substrate 2; a first optical adjustment layer 4 disposed on one side in the thickness direction of the transparent substrate 2 and made of a resin layer; an inorganic substance layer 5 disposed on one side in the thickness direction of the first optical adjustment layer 4 so as to make contact with the first optical adjustment layer 4; and a transparent conductive layer 6 disposed on one side in the thickness direction of the inorganic substance layer 5. The inorganic substance layer 5 has a thickness of 10 nm or less, and the surface of the one side in the thickness direction of the transparent conductive layer 6 has a surface roughness of 1.40 nm or less.
Transparent conductive film
A transparent conductive film 1 includes a transparent substrate 2; a first optical adjustment layer 4 disposed on one side in the thickness direction of the transparent substrate 2 and made of a resin layer; an inorganic substance layer 5 disposed on one side in the thickness direction of the first optical adjustment layer 4 so as to make contact with the first optical adjustment layer 4; and a transparent conductive layer 6 disposed on one side in the thickness direction of the inorganic substance layer 5. The inorganic substance layer 5 has a thickness of 10 nm or less, and the surface of the one side in the thickness direction of the transparent conductive layer 6 has a surface roughness of 1.40 nm or less.
TRANSPARENT CONDUCTIVE FILM
A transparent conductive film 1 includes, in this order, a transparent substrate 2, a first optical adjustment layer 4, an inorganic layer 5, and a transparent conductive layer 6. The first optical adjustment layer 4 has refraction nC lower than refraction nA of the transparent substrate 2, and thickness TC of 10 nm or more and 35 nm or less. The inorganic layer 5 has refraction nD that is lower than the absolute value |nC1.13| of a value obtained by multiplying the refraction nC of the first optical adjustment layer 4 by 1.13.
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure and hardware assembly, and method of forming the enclosure and assembly is provided. The biodegradable electric enclosure and hardware assembly is formed of a natural fiber thermoset composite (NFTC).
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure and hardware assembly, and method of forming the enclosure and assembly is provided. The biodegradable electric enclosure and hardware assembly is formed of a natural fiber thermoset composite (NFTC).
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure is provided and has a plate having a rear mounting surface and a front appearance surface. An aperture extends through the plate for receiving an electrical component. The plate is formed of a natural fiber thermoset composite (NFTC) having at least one fire-retardant additive.
BIODEGRADABLE HARDWARE
A biodegradable electrical enclosure is provided and has a plate having a rear mounting surface and a front appearance surface. An aperture extends through the plate for receiving an electrical component. The plate is formed of a natural fiber thermoset composite (NFTC) having at least one fire-retardant additive.