Disclosed herein is a method of: placing between a cooling element and an opposing surface a slurry of: a dielectric powder containing barium titanate, a dispersant, a binder, and water; maintaining the cooling element at a temperature below the opposing surface to cause the formation of ice platelets perpendicular to the surface of the cooling element and having the powder between the platelets; subliming the ice platelets to create voids; sintering the powder to form the dielectric material; and filling the voids with the polymeric material. The process can produce a composite having: a sintered dielectric material of barium titanate and platelets of a polymeric material embedded in the dielectric material. Each of the platelets is perpendicular to a surface of the composite.

Disclosed herein is a method of: placing between a cooling element and an opposing surface a slurry of: a dielectric powder containing barium titanate, a dispersant, a binder, and water; maintaining the cooling element at a temperature below the opposing surface to cause the formation of ice platelets perpendicular to the surface of the cooling element and having the powder between the platelets; subliming the ice platelets to create voids; sintering the powder to form the dielectric material; and filling the voids with the polymeric material. The process can produce a composite having: a sintered dielectric material of barium titanate and platelets of a polymeric material embedded in the dielectric material. Each of the platelets is perpendicular to a surface of the composite.

The present disclosure relates to insulation systems. Embodiments thereof may include a formulation for an insulation system used as casting resin and/or pressing resin as conductor and/or wall insulation for current-carrying conductors in generators, motors, and/or rotating machines. Some embodiments may include a material for use in an insulation system including: a base resin having one or more isotropic spherical filler fractions; wherein one of the one or more filler fractions comprises nanofiller particles comprising inorganic-organic particles; wherein both an inorganic fraction and an organic fraction are always simultaneously present; and the nanofiller particles comprise up to 25% by weight in the material.

The present disclosure relates to insulation systems. Embodiments thereof may include a formulation for an insulation system used as casting resin and/or pressing resin as conductor and/or wall insulation for current-carrying conductors in generators, motors, and/or rotating machines. Some embodiments may include a material for use in an insulation system including: a base resin having one or more isotropic spherical filler fractions; wherein one of the one or more filler fractions comprises nanofiller particles comprising inorganic-organic particles; wherein both an inorganic fraction and an organic fraction are always simultaneously present; and the nanofiller particles comprise up to 25% by weight in the material.

An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A method for manufacturing an insulated conductive material includes applying a masking material to one or more regions of a conductive material. Regions of the conductive material other than the masked regions are coated. The regions are coated by electrically charging the conductive material with a first charge polarity, providing a medium of electrically charged insulating material particles that are charged with an opposite polarity, and passing the charged conductive material through the medium, whereby the insulating material particles bind areas of the conductive material and form an insulating film on areas of the surface other than the one or more regions. Afterwards, the insulating film is cured and a solvent is applied to the masking material to thereby remove the masking material. The cured insulated material film is substantially unaffected by the solvent.

In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.