A method of manufacturing a laminate, transistor, and method of manufacturing transistor using a composition that includes an organic compound having a hydroxy group; a first cross-linking agent that is at least one organic silicon compound selected from the group including an organic silicon compound including a siloxane bond in the molecule and having three or more cyclic ether groups in the molecule, a chain organic silicon compound including two or more siloxane bonds in the molecule and having two or more cyclic ether groups in the molecule, a cyclic organic silicon compound including D unit in the molecule and having four or more cyclic ether groups bonded to a silicon atom of the D unit in the molecule, and a cyclic organic silicon compound including a T unit in the molecule and having two or more cyclic ether groups in the molecule; and a photocationic polymerization initiator.

A percutaneous connector assembly including a feedthrough assembly having a body and a plurality of electrically conductive feedthroughs extending through the body from a first end toward a second end thereof. A cable assembly having a plurality of conductors arranged side-by-side within a first plane to form a substantially flat portion thereof is included, each conductor being connected to a corresponding feedthrough of the feedthrough assembly and the flat portion extending from the body.

A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

Various embodiments include an insulation material and/or impregnation resin for a wrapping tape insulation, comprising: a base resin curing to a thermoset; and a curing agent. The base resin comprises a siloxane-containing compound forming a —SiR.sub.2—O— backbone in the thermoset.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

An insulation or jacket layer for a coated conductor is composed of (A) a crosslinked silane-functional polyolefin, (B) a filler composed of greater than 50 wt % silica, based on the total weight of the filler, (C) a silicone-containing polymer selected from the group consisting of reactive linear silicone-containing polymers, non-reactive linear silicone-containing polymers, and non-reactive branched silicone-containing polymers, and (D) from 0.00 wt % to 20 wt % of a silanol condensation catalyst, based on the total weight of the insulation or jacket layer.

An insulation or jacket layer for a coated conductor is composed of (A) a crosslinked silane-functional polyolefin, (B) a filler composed of greater than 50 wt % silica, based on the total weight of the filler, (C) a silicone-containing polymer selected from the group consisting of reactive linear silicone-containing polymers, non-reactive linear silicone-containing polymers, and non-reactive branched silicone-containing polymers, and (D) from 0.00 wt % to 20 wt % of a silanol condensation catalyst, based on the total weight of the insulation or jacket layer.

A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

An insulated wire, including: a conductor and an insulating film covering the conductor; in which at least one insulating layer constituting the insulating film contains: a thermosetting resin A, and a resin B that is ranked lower than the thermosetting resin A in a tribo-electric series.