A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

Provided are metal oxide varistors comprising a sintered ceramic, in which the ceramic comprises, by weight, about 91.0% to about 97.0% ZnO, at least 0.3% Mn, at least 0.4% Bi, at least 1.0% Sb, and 0.50% or less Co. The metal oxide varistors as disclosed herein may exhibit reduced power dissipation, improved thermal stability, and may be produced at a lower cost relative to conventional MOV devices.

Provided are metal oxide varistors comprising a sintered ceramic, in which the ceramic comprises, by weight, about 91.0% to about 97.0% ZnO, at least 0.3% Mn, at least 0.4% Bi, at least 1.0% Sb, and 0.50% or less Co. The metal oxide varistors as disclosed herein may exhibit reduced power dissipation, improved thermal stability, and may be produced at a lower cost relative to conventional MOV devices.

A multilayer varistor according to the present disclosure includes a sintered compact, at least one pair of internal electrodes, and at least one pair of external electrodes. The sintered compact contains at least a Zn oxide and a Pr oxide. The at least one pair of internal electrodes are provided inside the sintered compact and contain, as a main component, at least one selected from the group consisting of Pd and Ag and, as a sub-component, an oxide of at least one element selected from the group consisting of Pr, Mn, Co, and Sb. The at least one pair of external electrodes are arranged to cover the sintered compact partially and electrically connected to the at least one pair of internal electrodes, respectively.

A multilayer varistor according to the present disclosure includes a sintered compact, at least one pair of internal electrodes, and at least one pair of external electrodes. The sintered compact contains at least a Zn oxide and a Pr oxide. The at least one pair of internal electrodes are provided inside the sintered compact and contain, as a main component, at least one selected from the group consisting of Pd and Ag and, as a sub-component, an oxide of at least one element selected from the group consisting of Pr, Mn, Co, and Sb. The at least one pair of external electrodes are arranged to cover the sintered compact partially and electrically connected to the at least one pair of internal electrodes, respectively.

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A composite surge arrester assembly and method of construction protects electrical devices from voltage spikes by limiting the voltage supplied to an electric device by shorting to ground any unwanted voltages above a safe threshold. The composite surge arrester assembly forms an arrester array from an alternating arrangement of deformable conductive contact plates, and metal oxide varistor (MOV) blocks. The contact plates bend and have various types of surfaces to create uniform contact with MOV blocks. The MOV blocks are dimensioned to minimize metal mass. An epoxy impregnated fiberglass reinforcement member wraps around the arrester array at an angle between 0° to 90°, and preferably 45°, relative to the axial disposition of arrester array, while also purging air pockets therebetween. The reinforcement member dampens acoustic shock waves from high current impulses while maintaining electrical contact between MOV blocks. A polymer housing encapsulates the epoxy and fiberglass reinforced arrester array.

A composite surge arrester assembly and method of construction protects electrical devices from voltage spikes by limiting the voltage supplied to an electric device by shorting to ground any unwanted voltages above a safe threshold. The composite surge arrester assembly forms an arrester array from an alternating arrangement of deformable conductive contact plates, and metal oxide varistor (MOV) blocks. The contact plates bend and have various types of surfaces to create uniform contact with MOV blocks. The MOV blocks are dimensioned to minimize metal mass. An epoxy impregnated fiberglass reinforcement member wraps around the arrester array at an angle between 0° to 90°, and preferably 45°, relative to the axial disposition of arrester array, while also purging air pockets therebetween. The reinforcement member dampens acoustic shock waves from high current impulses while maintaining electrical contact between MOV blocks. A polymer housing encapsulates the epoxy and fiberglass reinforced arrester array.