A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.

A method for manufacturing a spark plug. The method includes: furnishing an insulator; introducing into the insulator a material mixture that is configured to constitute a resistor paste, the material mixture containing ZrO.sub.2 and SiO.sub.2; heating the insulator and the material mixture present therein to a temperature T of at least 870 C., so that ZrO.sub.2 and SiO.sub.2 in the material mixture react at least partly to ZrSiO.sub.4.

A thermally protected metal-oxide varistor is provided, including a disconnecting unit, a first varistor assembly and a second varistor assembly. The first varistor assembly and the second varistor assembly are connected in series through a low-melting-point alloy layer; wherein when the low-melting-point alloy layer is fused, the disconnecting unit acts to cut off the low-melting-point alloy. The two varistors are connected directly through solder joints without any transition connection member. The heat transfer path is reduced to the shortest path, and a faster response is realized compared to conventional products formed by a varistor and a disconnecting unit when abnormal over-current passes. Moreover, the slider functions as a physical separator capable of isolating the two varistors after the solder joints are fused, which further diminishes the risk of fire occurrence caused by the failure of instantly blocking current by the disconnecting unit when the varistor breaks down by over-current.

A spark plug which is capable of further improving load life performance and a resistor material for a spark plug are provided. A spark plug includes a center electrode, a terminal fitting, and a resistor disposed between the center electrode and the terminal fitting. The resistor contains glass, a zirconia-based material and an electrically conducting material. The zirconia-based material contains at least stabilized zirconia.

A spark plug which is capable of further improving load life performance and a resistor material for a spark plug are provided. A spark plug includes a center electrode, a terminal fitting, and a resistor disposed between the center electrode and the terminal fitting. The resistor contains glass, a zirconia-based material and an electrically conducting material. The zirconia-based material contains at least stabilized zirconia.

A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.

A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.