An over-voltage circuit protection device includes a voltage-dependent resistor component, and a printed circuit board (PCB) component connected to the voltage-dependent resistor component through first and second conductive lead layers. The PCB component includes a PCB body, a first conductive portion, a second conductive portion, at least one first conductive via and at least one second conductive via. The first and second conductive portions are disposed on the PCB body, and are electrically insulated from each other. The first and second conductive vias extend through the PCB body, and are defined by via-defining walls respectively covered by the first and second conductive portions.

In some embodiments, a gas discharge tube (GDT) can include first and second electrodes each including an edge and an inward facing surface, such that the inward facing surfaces of the first and second electrodes face each other. The GDT can further include a sealing portion implemented to join and seal the edge portions of the inward facing surfaces of the first and second electrodes to define a sealed chamber between the inward facing surfaces of the first and second electrodes. The GDT can further include an electrically insulating portion implemented to provide a surface in the sealed chamber and to cover a portion of the inward facing surface of each of at least one of the first and second electrodes such that a leakage path within the sealed chamber includes the surface of the electrically insulating portion.

The present disclosure relates to a semiconductor circuit breaker and, more specifically, to a semiconductor circuit breaker in which a protection circuit is modularized and thus maintenance and repair can be easily done. A semiconductor circuit breaker according to an embodiment of the present disclosure comprises: a main circuit unit connected between a power source and a load and having a semiconductor switch; an outer box equipped with the main circuit unit and having a module accommodation unit outside thereof; and a protection module detachably accommodated in the module accommodation unit.

An electrical assembly comprising an electrical connector assembly that may include: a utility device comprising a plurality of pins; a socket attached to a cord, the socket comprising a plurality of receptacles to receive the plurality of pins; and one or more metal-oxide varistors (MOVs) disposed inside the socket, where the one or more MOVs are electrically connected to the plurality of pins when the plurality of pins are received by the plurality of receptacles.

An electrical assembly comprising an electrical connector assembly that may include: a utility device comprising a plurality of pins; a socket attached to a cord, the socket comprising a plurality of receptacles to receive the plurality of pins; and one or more metal-oxide varistors (MOVs) disposed inside the socket, where the one or more MOVs are electrically connected to the plurality of pins when the plurality of pins are received by the plurality of receptacles.

The technology disclosed relates to an antenna system comprising two oppositely directed antennas integrated in a structure including two layers of resistivity switching material, and methods for controlling transmission of radiation through the layers of resistivity switching material to thereby allow for simultaneous and switchable transmission of antenna radiation in two opposite directions.

The technology disclosed relates to an antenna system comprising two oppositely directed antennas integrated in a structure including two layers of resistivity switching material, and methods for controlling transmission of radiation through the layers of resistivity switching material to thereby allow for simultaneous and switchable transmission of antenna radiation in two opposite directions.

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having 90 mol % of ZnO, from 0.5 to 5 mol % of Sb.sub.2O.sub.3, from 0.05 to 2 mol % of Co.sub.3O.sub.4, Mn.sub.2O.sub.3, SiO.sub.2 and/or Cr.sub.2O.sub.3, and <0.1 mol % of B.sub.2O.sub.3, Al.sub.2O.sub.3 and/or NiO.

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having 90 mol % of ZnO, from 0.5 to 5 mol % of Sb.sub.2O.sub.3, from 0.05 to 2 mol % of Co.sub.3O.sub.4, Mn.sub.2O.sub.3, SiO.sub.2 and/or Cr.sub.2O.sub.3, and <0.1 mol % of B.sub.2O.sub.3, Al.sub.2O.sub.3 and/or NiO.

A gas discharge tube (GDT) can include first and second electrodes each including an edge and an inward facing surface, such that the inward facing surfaces face each other. The GDT can further include a sealing portion implemented to join the edge portions of the first and second electrodes to form a chamber between the inward facing surfaces of the first and second electrodes. The GDT can further include an electrically insulating portion implemented to provide a surface that covers a portion of the inward facing surface of each of at least one of the first and second electrodes such that a leakage path between the first and second electrodes includes a path on the surface of the electrically insulating portion.