A resistor includes a resistive element including a first surface and a second surface facing opposite sides in a thickness direction; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes disposed spaced apart from each other in a first direction perpendicular to the thickness direction, the pair of electrodes being configured to come into contact with the resistive element. The protective film includes a first outer edge and a second outer edge spaced apart from each other in the first direction and extending in a second direction perpendicular to both the thickness direction and the first direction. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.

A resistor includes a resistive element including a first surface and a second surface facing opposite sides in a thickness direction; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes disposed spaced apart from each other in a first direction perpendicular to the thickness direction, the pair of electrodes being configured to come into contact with the resistive element. The protective film includes a first outer edge and a second outer edge spaced apart from each other in the first direction and extending in a second direction perpendicular to both the thickness direction and the first direction. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.

The invention relates to a switch including a switch housing, a contact system and a base disposed in the switch housing, a resistive element for diagnosing a state of a switch, and at least two terminals leading from the base. The resistive element has a specific resistance value. The resistive element is a conductive material formed on the base, the terminals being electrically connected by the conductive material.

The invention relates to a switch including a switch housing, a contact system and a base disposed in the switch housing, a resistive element for diagnosing a state of a switch, and at least two terminals leading from the base. The resistive element has a specific resistance value. The resistive element is a conductive material formed on the base, the terminals being electrically connected by the conductive material.

A method of manufacturing an electronic circuit comprises: providing an electronic circuit having a first configuration in which the circuit comprises a resistive element having a first resistance, and irradiating at least a part of the resistive element with electromagnetic radiation to change the resistance of the resistive element from the first resistance to a second resistance, the second resistance being lower than the first resistance. A method of storing data comprises: receiving a piece of data to be stored; determining a number according to the data; and irradiating at least part of a resistive element with that number of pulses of electromagnetic radiation to change a resistance of the resistive element from a first resistance to a second resistance, the second resistance being lower than the first resistance. A difference between the first resistance and the second resistance is dependent on the number. Corresponding circuits and data storage systems are disclosed.

A method of manufacturing an electronic circuit comprises: providing an electronic circuit having a first configuration in which the circuit comprises a resistive element having a first resistance, and irradiating at least a part of the resistive element with electromagnetic radiation to change the resistance of the resistive element from the first resistance to a second resistance, the second resistance being lower than the first resistance. A method of storing data comprises: receiving a piece of data to be stored; determining a number according to the data; and irradiating at least part of a resistive element with that number of pulses of electromagnetic radiation to change a resistance of the resistive element from a first resistance to a second resistance, the second resistance being lower than the first resistance. A difference between the first resistance and the second resistance is dependent on the number. Corresponding circuits and data storage systems are disclosed.

Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

A wiring substrate includes a ceramic substrate, a thin-film resistor disposed on the ceramic substrate, a first resin layer formed of a resin and disposed in a region on the ceramic substrate where the resistor is not disposed, and a second resin layer formed of a resin and covering the resistor on the ceramic substrate.