An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material.

A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodes

Two methods are provided to make aluminum terminal electrodes for chip resistors. For a chip resistor having a high resistance, the structure is not changed but the aluminum terminal electrode must have a high solid content, including a high aluminum content and a high glass content. For porous-aluminum terminal electrodes applied to a chip resistor having a low resistance, a new structure is formed to change current-conducting paths through different sizes of a protecting layer and a resistor layer. Therein, original paths conducting to the resistor layer through front terminal electrodes are changed into new paths conducting to the resistor layer through side terminal electrodes.

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.

Shown herein is a method of forming an electrical resistor comprising the steps of: forming an electrically resistive layer on a substrate; measuring an electrical resistance-related parameter of the electrically resistive layer and determining a target length of the electrically resistive layer corresponding to a target electrical resistance; and forming first and second electrically conductive terminals contacting the electrically resistive layer, said first and second electrically conductive terminals being separated by a distance corresponding to the target length.

A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

The present application addresses a method for establishing an electronic connection to an electronic component and a chip assembly. The method comprises the following steps. First, an electronic component having a first welding part is provided. Also a first electrical contact piece is provided. The first welding part and the first electrical contact piece are brought into mechanical contact with each other. Subsequently, while the mechanical contact is maintained, a welding current is applied which is capable of welding the electrical contact piece and the welding part together.

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.

The invention relates to a chip resistor. A method of manufacturing a chip resistor comprises the steps of: (a) applying a conductive paste on an insulating substrate, wherein the conductive paste comprises, (i) 40 to 80 weight percent (wt. %) of a conductive powder; (ii) 1 to 14 wt. % of a glass frit, (iii) 0.01 to 3 wt. % of magnesium oxide (MgO), and (iv) 10 to 55 wt. % of an organic vehicle, wherein the wt. % is based on weight of the conductive paste; (b) firing the applied conductive paste to form the front electrodes.

A sensor arrangement and a method for producing a sensor arrangement are disclosed. In an embodiment, the sensor arrangement for a temperature measurement includes a sensor element with at least one electrode and at least one contacting element, wherein the contacting element is arranged and configured for wireless contacting of the sensor element.