Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.

A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.

A magnetic sensor device includes a first magnetic sensor, a second magnetic sensor, and a soft magnetic structure. The first magnetic sensor generates a detection value corresponding to a component in a direction parallel to an X direction of an external magnetic field. The second magnetic sensor generates a detection value corresponding to a component in a direction parallel to a Y direction of the external magnetic field. In the presence of a residual magnetization in the X direction in the soft magnetic structure, a magnetic field that is based on the residual magnetization and contains a component in the −X direction is applied to the first magnetic sensor. In the presence of a residual magnetization in the Y direction in the soft magnetic structure, a magnetic field that is based on the residual magnetization and contains a component in the −Y direction is applied to the second magnetic sensor.

An electrical composite assembly includes a plurality of composite material macro-wires each including a magnetic material embedded within a nonmagnetic matrix. The magnetic material can be selected from magnetic microwires, magnetic nanowires, chains of magnetic nanoparticles, and chains of magnetic microparticles. The plurality of composite material macro-wires are included in an electrical component, where the electrical component is selected from a rotor, a stator, and an electromagnetic shield.

An electrical composite assembly includes a plurality of composite material macro-wires each including a magnetic material embedded within a nonmagnetic matrix. The magnetic material can be selected from magnetic microwires, magnetic nanowires, chains of magnetic nanoparticles, and chains of magnetic microparticles. The plurality of composite material macro-wires are included in an electrical component, where the electrical component is selected from a rotor, a stator, and an electromagnetic shield.

A method of formulating and using pastes, inks or adhesives made of electrically conductive and magnetically polarizable materials bound by a polymeric matrix includes depositing a paste, ink or adhesive at a low temperature, and using the paste, ink or adhesive as an electrically and magnetically and thermally active component, either in a wet or dried state. The polymer matrix provides the deposited product with mechanical properties, which integrate with the electrical and magnetic functions expressed by the other materials in the product. The product can be deposited both on a flexible and a rigid substrate, and can be used directly on the substrate, or in a form released from the substrate. The deposited product may be used as an electromagnetic and thermal component and device, such as an electromagnetic welder, electromagnetic heater, multifunctional material and coating passivating a static electric charge, magnetoresistive sensor, electromechanical relay, or electromechanical actuator.

A method of formulating and using pastes, inks or adhesives made of electrically conductive and magnetically polarizable materials bound by a polymeric matrix includes depositing a paste, ink or adhesive at a low temperature, and using the paste, ink or adhesive as an electrically and magnetically and thermally active component, either in a wet or dried state. The polymer matrix provides the deposited product with mechanical properties, which integrate with the electrical and magnetic functions expressed by the other materials in the product. The product can be deposited both on a flexible and a rigid substrate, and can be used directly on the substrate, or in a form released from the substrate. The deposited product may be used as an electromagnetic and thermal component and device, such as an electromagnetic welder, electromagnetic heater, multifunctional material and coating passivating a static electric charge, magnetoresistive sensor, electromechanical relay, or electromechanical actuator.

The magnetic sensor can prevent an increase of a positional detection error of a subject/object even in the case of applying an external magnetic field with a magnetic field intensity exceeding a predetermined range. A magnetic sensor is equipped with a magnetoresistive effect element (MR element) 11 that can detect an external magnetic field and a soft magnetic body shield 12. The soft magnetic body shield(s) 12 are/is positioned above and/or below the MR element 11 in a side view, and the size of the MR element 11 is physically included within a perimeter of the soft magnetic body shield 12.