The purpose of the present invention is to provide a magnetic recording medium capable of achieving high recording density by decreasing the bit transition width of a heat-assisted magnetic recording medium during the heat-assisted recording stage. The magnetic recording medium according to the present invention includes a non-magnetic substrate and a magnetic recording layer, wherein the magnetic recording layer includes an ordered alloy containing Fe, Pt and Ru, the ordered alloy includes x atom % of Fe, y atom % of Pt and z atom % of Ru on the basis of the total number of the Fe, Pt and Ru atoms, and the parameters x, y and z satisfy the following expressions (i)-(v): (i) 0.85x/y1.3; (ii) x53; (iii) y51; (iv) 0.6z20; and (v) x+y+z=100.

Disclosed herein are layered Heusler alloys. The layered Heusler alloys can comprise a first layer comprising a first Heusler alloy with a face-centered cubic (fcc) crystal structure and a second layer comprising a second Heusler alloy with a fcc crystal structure, the second Heusler alloy being different than the first Heusler alloy, wherein the first layer and the second layer are layered along a layering direction, the layering direction being the [110] or [111] direction of the fcc crystal structure, thereby forming the layered Heusler alloy.

Disclosed herein are layered Heusler alloys. The layered Heusler alloys can comprise a first layer comprising a first Heusler alloy with a face-centered cubic (fcc) crystal structure and a second layer comprising a second Heusler alloy with a fcc crystal structure, the second Heusler alloy being different than the first Heusler alloy, wherein the first layer and the second layer are layered along a layering direction, the layering direction being the [110] or [111] direction of the fcc crystal structure, thereby forming the layered Heusler alloy.

Various embodiments to mitigate the contamination of electroplated cobalt-platinum films on substrates are described. In one embodiment, a device includes a substrate, a titanium nitride diffusion barrier layer formed upon the substrate, a titanium layer formed upon the titanium nitride diffusion barrier layer, a platinum seed layer, and a cobalt-platinum magnetic layer formed upon the platinum seed layer. Based in part on the use of the titanium nitride diffusion barrier layer and/or the platinum seed layer, improvements in the interfaces between the layers can be achieved after annealing, with less delamination, and with substantial improvements in the magnetic properties of the cobalt-platinum magnetic layer. Further, the cobalt-platinum magnetic layer can be formed at a relatively thin thickness of hundreds of nanometers to a few microns while still maintaining good magnetic properties.

Provided herein are systems, methods, and compositions for magnetic nanoparticles and bulk nanocomposite magnets.

A magnetoresistance effect element is provided in which a MR ratio is not likely to decrease even at a high bias voltage. A magnetoresistance effect element according to an aspect of the present invention includes: a first ferromagnetic metal layer; a second ferromagnetic metal layer; a tunnel barrier layer that is provided between the first ferromagnetic metal layer and the second ferromagnetic metal layer, in which the tunnel barrier layer is formed of a non-magnetic oxide having a cubic crystal structure represented by a compositional formula A.sub.1-xA.sub.xO (A represents a divalent cation, and A represents a trivalent cation), a space group of the crystal structure is any one selected from the group consisting of Pm3m, I-43m, and Pm-3m, and the number of A ions is more than the number of A ions in a primitive lattice of the crystal structure.

A magnetoresistance effect element is provided in which a MR ratio is not likely to decrease even at a high bias voltage. A magnetoresistance effect element according to an aspect of the present invention includes: a first ferromagnetic metal layer; a second ferromagnetic metal layer; a tunnel barrier layer that is provided between the first ferromagnetic metal layer and the second ferromagnetic metal layer, in which the tunnel barrier layer is formed of a non-magnetic oxide having a cubic crystal structure represented by a compositional formula A.sub.1-xA.sub.xO (A represents a divalent cation, and A represents a trivalent cation), a space group of the crystal structure is any one selected from the group consisting of Pm3m, I-43m, and Pm-3m, and the number of A ions is more than the number of A ions in a primitive lattice of the crystal structure.

Disclosed are a spin-orbit torque material and device, and use of a delafossite oxide thin film, which relate to the field of spintronics. A chemical formula of the spin-orbit torque material is ABO.sub.2; wherein A and B are different heavy metal atoms, O is an oxygen atom, and a ratio between the numbers of A, B, and O atoms is 1:1:2. The spin-orbit torque material of an embodiment of the present application has higher spin-orbit torque efficiency and lower resistivity, and can reduce the power consumption of a spin-orbit torque device when it is used in the device.

A thin film magnet (TFM) three-dimensional (3D) inductor structure may include a substrate with conductive vias extending through the substrate. The TFM 3D inductor structure may also include a magnetic thin film layer on at least sidewalls of the conductive vias and on a first side and an opposing second side of the substrate. The TFM 3D inductor structure may further include a first conductive trace directly on the magnetic thin film layer on the first side of the substrate and electrically coupling to at least one of the conductive vias. The TFM 3D inductor structure also includes a second conductive trace directly on the magnetic thin film layer on the second side of the substrate and coupled to at least one of the conductive vias.

A thin film magnet (TFM) three-dimensional (3D) inductor structure may include a substrate with conductive vias extending through the substrate. The TFM 3D inductor structure may also include a magnetic thin film layer on at least sidewalls of the conductive vias and on a first side and an opposing second side of the substrate. The TFM 3D inductor structure may further include a first conductive trace directly on the magnetic thin film layer on the first side of the substrate and electrically coupling to at least one of the conductive vias. The TFM 3D inductor structure also includes a second conductive trace directly on the magnetic thin film layer on the second side of the substrate and coupled to at least one of the conductive vias.