An inductor component includes an element body, a coil, and a first outer electrode and a second outer electrode, in which the coil includes a coil wiring, a first extended wiring, and a second extended wiring. The first extended wiring includes a first connection surface connected to the coil wiring and a second connection surface connected to the first outer electrode, and a first straight line connecting the first connection surface and the second connection surface is inclined to the direction orthogonal to the first main surface.

Embodiments disclosed herein include electronic packages and methods of assembling such electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a plug is formed through the core, where the plug comprises a magnetic material. In an embodiment, an inductor is around the plug. In an embodiment, first layers are over the core, wherein where the first layers comprise a dielectric material; and second layers are under the core, where the second layers comprise the dielectric material.

Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers in a length direction and that has a built-in coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction being electrically connected to each other. The first and second outer electrodes respectively cover parts of first and second end surfaces and parts of a first main surface. Two coil conductors are stacked in order to form one turn of the coil. Adjacent land portions of coil conductors in the stacking direction are connected to each other through via conductors. In a plan view from a width direction, the land portions are disposed in an upper half of the multilayer body on the opposite side from the first main surface.

A device includes an integrated inductor and metal interconnect formed in an integrated circuit (IC) structure. The integrated inductor includes an inductor wire having a portion defined by an inductor element stack including (a) a metal layer inductor element formed in a metal layer in the IC structure and (b) a multi-component via layer inductor element formed in a via layer in the IC structure vertically adjacent the metal layer, and conductively connected to the metal layer inductor element. The multi-component via layer inductor element includes a via layer inductor element cup-shaped component formed from a first metal, and a via layer inductor element fill component formed from a second metal in an opening defined by the via layer inductor element cup-shaped component. The metal interconnect includes a metal layer interconnect element formed in the metal layer, and an interconnect via formed in the via layer from the first metal.

A device includes (a) an integrated inductor having an inductor wire and (b) a metal interconnect arrangement, both formed in an integrated circuit layer stack of alternating metal layers and via layers. At least a portion of the inductor wire is defined by an inductor element stack including multiple metal layer inductor elements formed in multiple respective metal layers, and multiple via layer inductor elements formed in multiple respective via layers and conductively connected to the metal layer inductor elements. Each via layer inductor element has a length of at least 1 μm in each of two lateral directions orthogonal to each other and perpendicular to the vertical direction. The metal interconnect arrangement includes metal layer interconnect elements formed in the respective metal layers, and interconnect vias formed in the respective via layers.

A coil component includes a main body portion containing resin, a coil provided in the main body portion, and an outer electrode electrically connected to the coil. A recess extending from a top surface of the main body portion toward a bottom surface thereof is provided in the side surface of the main body portion. The outer electrode is disposed in the recess, and a wall layer is interposed between the outer electrode and the inner surface of the recess.

Provided is an inductor stack structure. The inductor stack structure include a substrate; at least two metal layers sequentially stacked on one side of the substrate, each metal layer at least comprises a first plane inductor; a through hole, which is located between any two neighboring metal layers, first plane inductors in different metal layers are electrically connected through the through hole; and a thickness of the through hole is greater than that of the metal layer.

An inductor component that includes an element body; a coil wiring line that is arranged parallel to a first main surface of the element body inside the element body; and a first vertical wiring line and a second vertical wiring line that are buried inside the element body so that end surfaces thereof are exposed from the first main surface of the element body and that are electrically connected to the coil wiring line. In a first cross section that is perpendicular to a direction in which the coil wiring line extends and intersects the first vertical wiring line, a top surface of the coil wiring line contacts a bottom surface of the first vertical wiring line and the top surface of the coil wiring line is substantially shaped like a convex surface.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a package with integrated inductors. In selected examples, the package includes a core layer having a core thickness and through holes. The package further includes inductor structures within the through holes, such that an inductor structure has a length exceeding the core thickness.