In a multilayer coil component, a plurality of coil conductors are stacked in a coil axis direction. A connecting conductor connects the coil conductors adjacent to each other in the coil axis direction. First, second, and third coil conductors are arranged in order in the coil axis direction. A main body portion extends in a circumferential direction of the coil axis. Pad portions are connected to the main body portion, are connected to the first coil conductor via the connecting conductor, overhang from the third coil conductor in a direction away from the coil axis when viewed from the coil axis direction, and are inclined with respect to a virtual plane orthogonal to the coil axis direction.

A common mode choke coil includes a multilayer body obtained by stacking insulating layers, first and second coils inside the multilayer body, and first to fourth outer electrodes on outer surfaces of the multilayer body. The first and second outer electrodes are respectively connected to first and second ends of the first coil. The third and fourth outer electrodes are respectively connected to first and second ends of the second coil. The first coil includes first to third spiral conductors connected to one another through via conductors. The second coil includes fourth to sixth spiral conductors connected to one another through via conductors. The first spiral conductor is adjacent to the second and fourth spiral conductors. The fourth spiral conductor is adjacent to the first and fifth spiral conductors. The distance between the first and fourth spiral conductors is smaller than the distances between other spiral conductors.

A common mode noise filter includes: a laminated body; and a first and second coil conductors that are formed inside the laminated body and face each other in a first direction, wherein the first coil conductor has a first surface facing the second coil conductor; the second coil conductor has a second surface facing the first surface; a distance between ends of the first and second surfaces in the first direction is longer than a distance between centers of the first and second surfaces in the first direction; the first and second surfaces have corners each formed into an arcuate shape in a cross section; and a relationship between a height h in the first direction and a width w in a second direction perpendicular to the first direction is h≧w in a cross section of each of the first and second coil conductors.

A coil component includes: a body including a magnetic material; a substrate disposed in the body; a coil unit including first and second coil patterns disposed on both surfaces of the substrate, respectively, first and second via pads connected to inner ends of the first and second coil patterns, respectively, and a via connecting the first and second via pads to each other; and first and second external electrodes disposed to be spaced apart from each other on the body, while respectively being connected to the coil unit, wherein the first and second via pads include connection portions connected to the first and second coil patterns, respectively, and wing portions protruding from both side surfaces of the connection portions, and each of the first and second via pads has substantially the same or smaller line width than each of the first and second coil patterns.

A coil component includes: a body; a substrate disposed in the body, and having a first surface and a second surface facing each other; a coil unit including first and second coil patterns disposed on the first surface and the second surface of the substrate, respectively, first and second lead-out portions extending to surfaces of the body, a first connection portion disposed between the first coil pattern and the first lead-out portion, and a second connection portion disposed between the second coil pattern and the second lead-out portion; and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the first and second lead-out portions, respectively. Each of the first and second connection portions includes one connection pattern and at least one separation pattern. The connection pattern has a smaller line width than a respective one of the lead-out portions.

In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.

Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.

This disclosure relates generally to substrates having three dimensional (3D) inductors and methods of manufacturing the same. In one embodiment, the 3D inductor is a solenoid inductor where the exterior edge contour of the winding ends is substantially the same and substantially aligned with the exterior edge contour of the exterior edge contour of conductive vias that connect the windings. In this manner, there is no overhang between the windings and the conductive vias. In another embodiment of the 3D inductor, via columns connect connector plates. The via column attachment surfaces of each of the conductive vias in each of the columns is the same and substantially aligned. In this manner, carrier pads are not needed and there is no overhand between the conductive vias.

Methods of fabricating magnetic core inductors for an integrated voltage regulator are disclosed. In some methods, an insulating layer is attached upon a carrier layer, and the insulating layer is patterned to form a core area and a trench area. A conductive inner core is formed in the core area. A magnetic winding coil is formed in the trench area.

Embodiments may include inductors with embedded magnetic cores and methods of making such inductors. In an embodiment, an integrated circuit package may include an integrated circuit die with a multi-phase voltage regulator electrically coupled to the integrated circuit die. In such embodiments, the multi-phase voltage regulator may include a substrate core and a plurality of inductors. The inductors may include a conductive through-hole disposed through the substrate core and a plugging layer comprising a dielectric material surrounding the conductive through-hole. In an embodiment, a magnetic sheath is formed around the plugging layer. In an embodiment, the magnetic sheath is separated from the plated through hole by the plugging layer. Additionally, a first layer comprising a dielectric material may be disposed over a first surface of the magnetic sheath, and a second layer comprising a dielectric material may be disposed over a second surface of the magnetic sheath.