A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

A band pass filter includes a first filter circuit, a second filter circuit, a first intermediate circuit, a second intermediate circuit, and a ninth capacitor. The first intermediate circuit includes a seventh inductor connected between a fifth capacitor and a sixth capacitor. The second intermediate circuit includes an eighth inductor connected between a seventh capacitor and an eighth capacitor. The ninth capacitor is connected between the first intermediate circuit and the second intermediate circuit.

An electronic component includes a component base body and first and second outer electrodes covering respective end faces of the component base body. The component base body includes an element main body and a magnetic body portion covering the element main body. The element main body includes a linear inner conductor, a dielectric layer covering the periphery of part of the inner conductor, and a conductor layer formed to cover the dielectric layer.

An electronic component includes a multilayer body obtained by laminating a plurality of insulator layers the shape of which is substantially rectangular in plan view, a coil conductor in a substantially spiral shape provided on an insulator layer, and a land electrode located outside the coil conductor. The land electrode faces two sides intersecting at a vertex of the substantially rectangular shape when viewed along a direction of laminating the insulator layers, and is electrically connected to an end portion of the coil conductor, in which a shortest distance from one side of the two sides to the land electrode is equal to or longer than a shortest distance from the coil conductor to the one side.

A circuit board has a glass core in which a through hole is formed, and a conductor pattern is formed on an inner peripheral wall of the through hole and a surface of the glass core to form a circuit element including a solenoid coil element and a capacitor element. Accordingly, a low-cost and compact circuit board capable of supporting high-capacity communication for thin mobile communication devices such as smartphones can be provided. Since the circuit board can be electrically connected to at least one of the electronic components such as a switch, an amplifier, and a filter via one terminal, and can be electrically connected to a mother board via another terminal, it has integrated functions, and can be suitably used for thin mobile communication devices such as smartphones.

A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.

An electronic component is mounted on a circuit board such that a mounting surface of an element body to which a first outer electrode and a second outer electrode are exposed is directed toward the circuit board. A coil is formed of a spiral coil in which a plurality of coil conductor layers arranged in a direction perpendicular to a first side surface and a second side surface orthogonal to the mounting surface are connected in series. Then, an intermediate point between a lowest point closest to the mounting surface and an uppermost point farthest from the mounting surface in an inner circumference of the coil is offset from the center of the element body in a direction perpendicular to the mounting surface toward the opposite side to the mounting surface.

A multilayer LC filter includes a multilayer body in which dielectric layers are laminated, first linear conductive patterns, second linear conductive patterns, third linear conductive patterns, capacitor conductive patterns, ground conductive patterns, and via conductors. When the multilayer body is seen through in the direction in which the dielectric layers are laminated, the first linear conductive patterns and the third linear conductive patterns in a first inductor intersect with each other, and the first linear conductive patterns and the third linear conductive patterns in a second inductor intersect with each other.

An ESD-protective surface-mount composite component that includes a surface-mount inductor and a thin-film component. The surface-mount inductor includes a body, a first outer conductor and a second outer conductor individually formed at both ends of the body in a first direction, and a third outer conductor formed at an intermediate position of the body in the first direction. The thin-film component includes a flat plate-like body, an ESD protection element formed inside the body, a first terminal conductor connected to the ESD protection element and formed on a front surface of the body, and a second terminal conductor connected to the ESD protection element and formed on the front surface of the body. The first terminal conductor is joined to the first outer conductor, and the second terminal conductor is joined to the third outer conductor.

A filter element includes series inductors connected in series to a signal path, shunt inductors shunt-connected between the signal path and ground, and a capacitor connected in series to the shunt inductors. The shunt inductors include first and second shunt inductors connected in parallel to each other. Conductive patterns of the capacitor are overlapped with coil opening portions of the series inductors and the shunt inductors viewed from a lamination direction. The capacitor is sandwiched between the first shunt inductor and the second shunt inductor in the lamination direction of insulating layers and the conductive patterns.